公开(公告)号：US20240014049A1

公开(公告)日：2024-01-11

申请号：US18124255

申请日：2023-03-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chulho Jung ,  Jihan Ko ,  Kunsil Lee

IPC: H01L21/56 ,  H01L21/67

CPC classification number: H01L21/566 ,  H01L21/67126

Abstract: A release film for a mold process capable of minimizing defects of a semiconductor package in a semiconductor packaging process, and a method for manufacturing the release film for a mold process are provided. The release film for the mold process includes a base film and a plurality of conductive fillers located inside the base film and arranged on upper and/or lower surfaces of the base film, wherein roughness is formed by the plurality of conductive fillers on the upper and/or lower surfaces of the base film, and a conductive path is formed between the upper and lower surfaces of the base film.

公开(公告)号：US20230082912A1

公开(公告)日：2023-03-16

申请号：US17724568

申请日：2022-04-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wongi Chang ,  Dongkwan Kim ,  Jihan Ko ,  Jungseok Ryu ,  Youngmin Lee

IPC: H01L25/065

Abstract: A semiconductor package includes a circuit board including a wiring structure, first and second semiconductor chips disposed on the circuit board and connected to the wiring structure, a dummy chip disposed on the circuit board and positioned between the first and second semiconductor chips, and a molded member disposed on the circuit board and surrounding the first and second semiconductor chips and the dummy chip. The dummy chip may include a rounded edge between an upper surface and a side surface.