公开(公告)号：US20190189470A1

公开(公告)日：2019-06-20

申请号：US16039384

申请日：2018-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Myung PARK ,  Dong Woo LEE ,  Jin Hong LEE ,  Young Seok JUNG ,  Kang Min PAEK

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B08B1/00 ,  B08B1/04 ,  B08B3/02

CPC classification number: H01L21/67046 ,  B08B1/002 ,  B08B1/04 ,  B08B3/022 ,  H01L21/02057 ,  H01L21/67051 ,  H01L21/68764

Abstract: A wafer cleaning apparatus includes a wafer roller to rotate a wafer in a first direction, first and second roller brushes disposed to be parallel to each other, the first and second roller brushes to be brought into contact with opposing surfaces of the wafer to clean the opposing surfaces of the wafer, respectively, while rotating in mutually opposing directions, first and second pipes having a longitudinal direction parallel to each other, the first and second pipes being above the first and second roller brushes and conveying a cleaning liquid for cleaning the wafer, first and second nozzle groups disposed along the longitudinal direction of the pipes, respectively, and including a plurality of nozzles to spray the cleaning liquid onto the opposing surfaces of the wafer at a predetermined angle, respectively, and a binding part connecting the first and second pipes to restrain movement of the first and second pipes.