公开(公告)号：US10748846B2

公开(公告)日：2020-08-18

申请号：US16582706

申请日：2019-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Se-Il Oh ,  Jung-Ha Oh ,  Hyuck-Joon Kwon ,  Jong-Hyuk Kim ,  Jong-Moon Yoon

IPC: H01L23/522 ,  H01L23/14 ,  H01L23/482 ,  H01L23/532 ,  H01L23/485 ,  H01L49/02 ,  H01L23/00 ,  H01L23/58

Abstract: A semiconductor device may include an insulating layer, a pad, a circuit, at least one first wiring, at least one second wiring, at least one third wiring, and a pad contact. The pad may be disposed on the insulating layer. The circuit may be disposed in the insulating layer. The circuit may be positioned below the pad. The first wiring may be disposed between the pad and the circuit. The second wiring may be disposed between the pad and the first wiring. The third wiring may be disposed between the pad and the second wiring. The pad contact may be configured to directly connect the pad to the circuit.

公开(公告)号：US10438886B2

公开(公告)日：2019-10-08

申请号：US15674878

申请日：2017-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Se-Il Oh ,  Jung-Ha Oh ,  Hyuck-Joon Kwon ,  Jong-Hyuk Kim ,  Jong-Moon Yoon

IPC: H01L23/522 ,  H01L49/02 ,  H01L23/485 ,  H01L23/58 ,  H01L23/482 ,  H01L23/14 ,  H01L23/532

Abstract: A semiconductor device may include an insulating layer, a pad, a circuit, at least one first wiring, at least-one second wiring, at least one third wiring, and a pad contact. The pad may be disposed on the insulating layer. The circuit may be disposed in the insulating layer. The circuit may be positioned below the pad. The first wiring may be disposed between the pad and the circuit. The second wiring may be disposed between the pad and the first wiring. The third wiring may be disposed between the pad and the second wiring. The pad contact may be configured to directly connect the pad to the circuit.