公开(公告)号：US20200211920A1

公开(公告)日：2020-07-02

申请号：US16540495

申请日：2019-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil LEE ,  Myung-Sung KANG ,  Yeongseok KIM ,  Gwangsun SEO ,  Hyein YOO ,  Yongwon CHOI

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

公开(公告)号：US20220020664A1

公开(公告)日：2022-01-20

申请号：US17376600

申请日：2021-07-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil LEE ,  Wonkeun KIM ,  Mihyae PARK

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/31 ,  H01L23/552 ,  H01L25/065 ,  H01L25/10

Abstract: A semiconductor package includes at least one semiconductor device mounted on a first substrate, a thermosetting resin layer on the at least one semiconductor device, the thermosetting resin layer including an irreversible thermochromic pigment, a metal plate on the thermosetting resin layer, and a molding member surrounding the at least one semiconductor device at least in a lateral direction and being in contact with the thermosetting resin layer.

公开(公告)号：US20190198450A1

公开(公告)日：2019-06-27

申请号：US16037226

申请日：2018-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil LEE ,  YEONGSEOK KIM

IPC: H01L23/552 ,  H01L23/367 ,  H01L23/00

Abstract: Semiconductor packages and modules are provided. The semiconductor package includes a package substrate; a semiconductor chip disposed on the package substrate; a molding layer covering the semiconductor chip and a first region of the package substrate; and a functional layer covering the molding layer and extending onto a second region of the package substrate that surrounds the first region.

公开(公告)号：US20220246491A1

公开(公告)日：2022-08-04

申请号：US17726916

申请日：2022-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil LEE ,  Myung-Sung KANG ,  Yeongseok KIM ,  Gwangsun SEO ,  Hyein YOO ,  Yongwon CHOI

IPC: H01L23/373 ,  H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  C09J7/28 ,  C09J11/04

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

公开(公告)号：US20190281736A1

公开(公告)日：2019-09-12

申请号：US16131596

申请日：2018-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joungphil LEE

IPC: H05K9/00 ,  H01L23/31 ,  B32B15/04 ,  B32B7/12 ,  B32B17/06

Abstract: A semiconductor package including a package substrate including a ground layer, a first segment of which is exposed to outside the package substrate, a semiconductor chip on the package substrate, and a functional layer including a conductive polymer and an adhesive polymer, covering the semiconductor chip, and being in contact with the first segment of the ground layer may be provided.