公开(公告)号：US20220246491A1

公开(公告)日：2022-08-04

申请号：US17726916

申请日：2022-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil LEE ,  Myung-Sung KANG ,  Yeongseok KIM ,  Gwangsun SEO ,  Hyein YOO ,  Yongwon CHOI

IPC: H01L23/373 ,  H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  C09J7/28 ,  C09J11/04

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

公开(公告)号：US20200211920A1

公开(公告)日：2020-07-02

申请号：US16540495

申请日：2019-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil LEE ,  Myung-Sung KANG ,  Yeongseok KIM ,  Gwangsun SEO ,  Hyein YOO ,  Yongwon CHOI

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.