公开(公告)号：US20190134974A1

公开(公告)日：2019-05-09

申请号：US15982146

申请日：2018-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ho YU ,  Dong Wook KIM ,  Byeong Sang KIM ,  Kyung Bin PARK ,  Ki Ju SOHN ,  Ju Hyun LEE

IPC: B41F23/04 ,  F26B3/28 ,  B41M7/00

Abstract: An ultraviolet curing apparatus includes a housing, a plurality of ultraviolet light emitting diodes (LEDs) arranged in a length direction of the housing, and at least one shutter part coupled to the housing to be movable in the length direction, to cover at least a portion of the plurality of ultraviolet LEDs to limit an irradiation region of ultraviolet light emitted by the plurality of ultraviolet LEDs.

公开(公告)号：US20240063044A1

公开(公告)日：2024-02-22

申请号：US18202892

申请日：2023-05-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Hoon KWON ,  Ju Hyun LEE ,  Bo Un YOON

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01L21/68 ,  H01L21/6838 ,  H01L21/68757 ,  H01L21/68785

Abstract: A method of fabricating a semiconductor device comprises mounting a carrier substrate and a wafer on a wafer chuck of a wafer chuck apparatus, the carrier substrate and the wafer attached to each other, injecting air into an air member by selectively controlling at least one air injection pipe connected to the air member of the wafer chuck apparatus, tilting the wafer chuck to a predetermined angle in response to the air being injected into the air member, processing the wafer while the wafer chuck is tilted, determining whether to change a tilt angle of the wafer chuck or a position of the wafer, adjusting an amount of air injected into the air member according to a changed tilt angle of the wafer chuck or a changed position of the wafer, and processing the wafer after adjusting of the amount of air in the air member.

公开(公告)号：US20190131164A1

公开(公告)日：2019-05-02

申请号：US15996848

申请日：2018-06-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeong Sang KIM ,  Ki Ju SOHN ,  Ju Hyun LEE ,  Dong Wook KIM ,  Kyung Bin PARK ,  Woo Sub SHIM ,  Jung Wook KIM ,  Ho YU ,  Myoung Soo CHOI ,  Eun Soo HWANG

IPC: H01L21/687 ,  H01J37/32 ,  H01L21/67

Abstract: A substrate processing apparatus includes an exhaust unit including a lower surface in which an outlet is formed and four side walls extended from the lower surface, the exhaust unit having exhaust wings protruding from two opposing side walls, a shower head located in the exhaust unit and having distribution holes, and an adjuster disposed on each of side walls of the exhaust unit between the exhaust wings.