公开(公告)号：US20230170222A1

公开(公告)日：2023-06-01

申请号：US17842962

申请日：2022-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Hoon KWON ,  Chung Ki MIN ,  Bo Un YOON ,  Ki Hoon JANG

IPC: H01L21/306 ,  B24B37/04 ,  B24B57/02

CPC classification number: H01L21/30625 ,  B24B37/042 ,  B24B57/02

Abstract: A method for fabricating a semiconductor device includes providing a polishing pad which includes a first region and a second region separated from each other by a fence, loading a wafer onto the first region, providing a slurry solution onto the first region, providing an ultrapure water onto the second region, turning the polishing pad to polish a surface of the wafer, and unloading the wafer from the polishing pad after polishing on the surface of the wafer is completed, wherein the fence includes a first fence extending from a center of the polishing pad toward an edge of the polishing pad in a first horizontal direction, and a second fence extending from the center of the polishing pad toward the edge of the polishing pad in a second horizontal direction different from the first horizontal direction.

公开(公告)号：US20240145254A1

公开(公告)日：2024-05-02

申请号：US18328298

申请日：2023-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyo-Jung KIM ,  Dong Hoon KWON

IPC: H01L21/321 ,  H01L21/02 ,  H01L21/304 ,  H01L21/67

CPC classification number: H01L21/3212 ,  H01L21/02024 ,  H01L21/3043 ,  H01L21/67219

Abstract: A chemical mechanical polishing apparatus capable of controlling polishing temperature, and a method of fabricating a semiconductor device using the same are provided. The chemical mechanical polishing apparatus includes a platen, a polishing pad on the platen, the polishing pad including a plurality of grooves, and a light irradiator in the platen, the light irradiator configured to irradiate light toward the polishing pad, wherein the polishing pad includes a light transmission pattern interposed between at least some of the plurality of grooves and the light irradiator and through which the light is transmitted.

公开(公告)号：US20240234164A1

公开(公告)日：2024-07-11

申请号：US18353293

申请日：2023-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won Keun CHO ,  Dong Hoon KWON ,  Ki Hoon JANG

IPC: H01L21/321 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/3212 ,  H01L21/67103 ,  H01L21/67219 ,  H01L21/67248 ,  H01L21/67706

Abstract: A substrate processing device includes a platen, a polishing pad disposed on the platen, a first rotating body, a second rotating body spaced apart from the first rotating body, a caterpillar module disposed on a portion of the polishing pad and engaged with the first rotating body and the second rotating body, and a temperature controller thermally connected to the caterpillar module.

公开(公告)号：US20240063044A1

公开(公告)日：2024-02-22

申请号：US18202892

申请日：2023-05-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Hoon KWON ,  Ju Hyun LEE ,  Bo Un YOON

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01L21/68 ,  H01L21/6838 ,  H01L21/68757 ,  H01L21/68785

Abstract: A method of fabricating a semiconductor device comprises mounting a carrier substrate and a wafer on a wafer chuck of a wafer chuck apparatus, the carrier substrate and the wafer attached to each other, injecting air into an air member by selectively controlling at least one air injection pipe connected to the air member of the wafer chuck apparatus, tilting the wafer chuck to a predetermined angle in response to the air being injected into the air member, processing the wafer while the wafer chuck is tilted, determining whether to change a tilt angle of the wafer chuck or a position of the wafer, adjusting an amount of air injected into the air member according to a changed tilt angle of the wafer chuck or a changed position of the wafer, and processing the wafer after adjusting of the amount of air in the air member.