公开(公告)号：US20220068904A1

公开(公告)日：2022-03-03

申请号：US17220468

申请日：2021-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho PARK ,  Seung Hwan KIM ,  Jun Young OH ,  Jungjoo KIM ,  Yongkwan LEE ,  Dong-Ju JANG

IPC: H01L25/18 ,  H01L23/538 ,  H01L25/00

Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.

公开(公告)号：US20210391199A1

公开(公告)日：2021-12-16

申请号：US17200981

申请日：2021-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun Young OH ,  Seung Hwan KIM ,  Jong Ho PARK ,  Yong Kwan LEE ,  Jong Ho LEE

IPC: H01L21/673

Abstract: The present disclosure provides a magazine supporting equipment for supporting a magazine with multiple input ports. The magazine supporting equipment comprises a contact plate, a first sidewall plate, and a second sidewall plate. The contact plate is in contact with the magazine. The first sidewall plate extends vertically from one end of the contact plate. The second sidewall plate parallel is to the first sidewall plate and extends vertically from one end to the other end of the contact plate. The first sidewall plate extends along at least a part of a first sidewall of the magazine. The second sidewall plate extends along at least a part of a second sidewall of the magazine. The first sidewall plate and the second sidewall plate include control openings through which gas flows in and out.

公开(公告)号：US20240178202A1

公开(公告)日：2024-05-30

申请号：US18356035

申请日：2023-07-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongchan KIM ,  Un-Byoung KANG ,  Jumyong PARK ,  Dongjoon OH ,  Jun Young OH ,  Jeongil LEE ,  Chungsun LEE

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/105 ,  H01L23/49822 ,  H01L24/08 ,  H01L24/09 ,  H01L24/80 ,  H10B80/00

Abstract: A semiconductor device includes: a semiconductor layer including a wire and an electrical element; and a plurality of metal pads on a surface of the semiconductor layer, wherein the plurality of metal pads includes a first metal pad and a second metal pad, wherein the second metal pad is smaller in surface area or diameter on the surface of the semiconductor layer than the first metal pad, and wherein the second metal pad is between a first region of the surface of the semiconductor layer where the first metal pad is and a second region of the surface of the semiconductor layer where a surface metal density is zero (0).