公开(公告)号：US09999957B2

公开(公告)日：2018-06-19

申请号：US15001410

申请日：2016-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun-Seok Choi ,  Chang-Gil Ryu ,  Geun-Young Song ,  Ki-Yeon Chu ,  Jin-Suk Hong

IPC: B24B37/32 ,  B24B55/02 ,  B24B37/30

CPC classification number: B24B37/32 ,  B24B37/30 ,  B24B55/02

Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.