公开(公告)号：US20210057480A1

公开(公告)日：2021-02-25

申请号：US17091236

申请日：2020-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoung-chul Eum ,  Hye-kyoung Lee ,  Chang-kun Kang ,  Jae-hyun Kim ,  Kyeong-il Oh ,  Seung-keun Oh ,  Chi-hwan Lee

IPC: H01L27/146 ,  H01L21/78 ,  C09D133/08 ,  C09D133/14 ,  C08F220/18 ,  C08F220/28 ,  C08F220/30 ,  H01L21/683

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and cis amole fraction; a+b+c=1; 0.05≤a/(a+b+c)≤0.3; 0.1≤b/(a+b+c)≤0.6; 0.1≤c/(a+b+c)≤0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

公开(公告)号：US10854666B2

公开(公告)日：2020-12-01

申请号：US16229972

申请日：2018-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoung-chul Eum ,  Hye-kyoung Lee ,  Chang-kun Kang ,  Jae-hyun Kim ,  Kyeong-il Oh ,  Seung-keun Oh ,  Chi-hwan Lee

IPC: G03F7/09 ,  G03F7/038 ,  G03F7/16 ,  H01L27/146 ,  H01L21/78 ,  C09D133/08 ,  C09D133/14 ,  C08F220/18 ,  C08F220/28 ,  C08F220/30 ,  H01L21/683

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05≤a/(a+b+c)≤0.3; 0.1≤b/(a+b+c)≤0.6; 0.1≤c/(a+b+c)≤0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

公开(公告)号：US11309345B2

公开(公告)日：2022-04-19

申请号：US17091236

申请日：2020-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoung-chul Eum ,  Hye-kyoung Lee ,  Chang-kun Kang ,  Jae-hyun Kim ,  Kyeong-il Oh ,  Seung-keun Oh ,  Chi-hwan Lee

IPC: G03F7/09 ,  G03F7/038 ,  G03F7/16 ,  H01L27/146 ,  H01L21/78 ,  C09D133/08 ,  C09D133/14 ,  H01L21/683 ,  C08F220/30 ,  C08F220/18 ,  C08F220/28 ,  C08K5/544

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05≤a/(a+b+c)≤0.3; 0.1≤b/(a+b+c)≤0.6; 0.1≤c/(a+b+c)≤0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

公开(公告)号：US20190245003A1

公开(公告)日：2019-08-08

申请号：US16229972

申请日：2018-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoung-chul Eum ,  Hye-kyoung Lee ,  Chang-kun Kang ,  Jae-hyun Kim ,  Kyeong-il Oh ,  Seung-keun Oh ,  Chi-hwan Lee

IPC: H01L27/146 ,  H01L21/683 ,  H01L21/78 ,  C09D133/08 ,  C09D133/14 ,  C08F220/18 ,  C08F220/28 ,  C08F220/30

CPC classification number: H01L27/14687 ,  C08F220/18 ,  C08F220/28 ,  C08F220/30 ,  C08F2220/1841 ,  C08F2220/185 ,  C08F2220/1858 ,  C08F2220/1875 ,  C08F2220/1891 ,  C08F2220/281 ,  C08F2220/282 ,  C08F2220/301 ,  C08F2220/302 ,  C08F2220/305 ,  C09D133/08 ,  C09D133/14 ,  H01L21/6835 ,  H01L21/78 ,  H01L27/14627 ,  H01L27/14645 ,  H01L27/14685 ,  H01L2221/68327 ,  H01L2221/6834

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05≤a/(a+b+c)≤0.3; 0.1≤b/(a+b+c)≤0.6; 0.1≤c/(a+b+c)≤0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.