公开(公告)号：US20210398479A1

公开(公告)日：2021-12-23

申请号：US17189635

申请日：2021-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungjun KIM

IPC: G09G3/32 ,  H01L25/16

Abstract: A light-emitting diode (LED) package includes a first LED pixel including a plurality of first LED chips and a first pixel driving integrated circuit to drive the first LED chips according to an active matrix (AM) mode using entirety of a first frame period, wherein the first pixel driving integrated circuit includes a first storage area configured to store first frame data of each first LED chip, a second storage area configured to store duty ratio compensation data of each first LED chip, a pulse width modulation (PWM) data calculator configured to perform an arithmetic operation on the first frame data and the duty ratio compensation data to generate PWM data, and a PWM data generator configured to adjust an emission duty ratio based on the PWM data.

公开(公告)号：US20210376200A1

公开(公告)日：2021-12-02

申请号：US17142435

申请日：2021-01-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungjun KIM ,  Jaeyoo JEONG

IPC: H01L33/50 ,  H01L33/60 ,  H01L27/15 ,  H01L33/62 ,  H05B45/28

Abstract: A flash LED package includes a substrate; a flash LED device in a first region of an upper surface of the substrate, and including first to fourth LED light sources that emit white light, blue light, green light, and red light, respectively; an optical sensor in a second region of the upper surface of the substrate, and having a light receiving region that detects a correlated color temperature; and a lens cover on the substrate to cover the flash LED device and the optical sensor, and having a lens unit in a region overlapping the first to fourth LED light sources.

公开(公告)号：US20210256898A1

公开(公告)日：2021-08-19

申请号：US17060998

申请日：2020-10-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungjun KIM

IPC: G09G3/32

Abstract: A display apparatus includes a plurality of light emitting diode (LED) packages arranged in a matrix on a module substrate and a controller. Each of the plurality of LED packages includes a pixel driving integrated circuit and a first LED chip, a second LED chip, and a third LED chip on the pixel driving integrated circuit. The pixel driving integrated circuit controls, based on a control signal of the controller, a pulse width of current applied to the first, second, and third LED chips at a first current level or at a second current level.

公开(公告)号：US20210065614A1

公开(公告)日：2021-03-04

申请号：US16800023

申请日：2020-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungjun KIM ,  Dongsoo LIM

IPC: G09G3/32 ,  H01L33/62

Abstract: A light emitting device package includes a first light emitting diode pixel, the first light emitting diode pixel including first light emitting diode chips that each emit light, and a first pixel driving integrated circuit under the first light emitting diode chips of the first light emitting diode pixel, the first pixel driving integrated circuit configured to drive the first light emitting diode chips based on an active matrix scheme, in which each of the first light emitting diode chips is driven using an entire one frame interval, and based on a pulse width modulation scheme, in which a time during which each of first driving currents is applied to a respective one of the first light emitting diode chips is controlled within the entire one frame interval.

公开(公告)号：US20230133634A1

公开(公告)日：2023-05-04

申请号：US17886208

申请日：2022-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seolyoung CHOI ,  Sun KIM ,  Kyoungjun KIM ,  Junghun LEE

IPC: H01L33/64 ,  H01L33/60 ,  H01L33/62

Abstract: A semiconductor light emitting device package includes: a ceramic substrate having first and second electrode structures; a light emitting diode chip mounted on the ceramic substrate, electrically connected to the first and second electrode structures, and configured to emit ultraviolet light; metal patterns disposed on the ceramic substrate to be spaced apart from the first and second electrode structures; an adhesive pattern disposed on the ceramic substrate between the adjacent metal patterns, the adhesive pattern having both side surfaces in contact with one side surface of the metal patterns and an upper surface positioned on a level below that of a lower surface of the light emitting diode chip; and a protector attached to the ceramic substrate by the adhesive pattern, the protector providing a cavity surrounding the light emitting diode chip.