公开(公告)号：US20200098599A1

公开(公告)日：2020-03-26

申请号：US16397552

申请日：2019-04-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： TAEYEONG KIM ,  MINSOO HAN ,  JUN HYUNG KIM ,  HOONJOO NA ,  KWANGJIN MOON

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A substrate bonding apparatus includes a lower chuck that receives a lower substrate and an upper chuck disposed above the lower chuck. An upper substrate is fixed to the upper chuck. The upper chuck and the lower chuck bond the upper substrate to the lower substrate. The upper chuck has an upper convex surface toward the lower chuck. The upper convex surface includes a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction.

公开(公告)号：US20220172977A1

公开(公告)日：2022-06-02

申请号：US17460424

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： DAEHO MIN ,  JUNHYUNG KIM ,  MINSOO HAN ,  MNGU LEE ,  MINWOO RHEE

IPC: H01L21/683 ,  B25J15/06 ,  B65G47/91

Abstract: A substrate transfer apparatus includes a body portion having a holding region on a surface thereof corresponding to a substrate. The body portion moves so that the surface thereof approaches the substrate up to at least a first distance. A plurality of vacuum holes are distributed in the holding region and form negative pressure to provide suction force to the substrate disposed at the first distance. At least some of the plurality of vacuum holes are disposed at equal intervals at an edge of the holding region and have the same width. A plurality of air holes are distributed in the holding region and form positive pressure to provide a buoyancy force to the substrate close to the holding region at a second distance smaller than the first distance.