公开(公告)号：US20210057373A1

公开(公告)日：2021-02-25

申请号：US16933055

申请日：2020-07-20

Applicant: SAMSUNG ELECTRONICS CO, LTD.

Inventor： TAEYEONG KIM ,  ILYOUNG HAN ,  HOECHUL KIM

IPC: H01L23/00

Abstract: A substrate bonding method and apparatus are described. The substrate bonding apparatus is used to bond a first substrate to a second substrate. The bonding apparatus includes a first bonding chuck configured to hold the first substrate on a first surface of the first bonding chuck; a second bonding chuck configured to hold the second substrate on a second surface of the second bonding chuck, the second surface facing the first surface of the first bonding chuck; a seal arranged between the first bonding chuck and the second bonding chuck and adjacent to at least one edge of the first substrate and at least one edge of the second substrate; and a process gas supply device configured to supply a process gas to a bonding space surrounded by the seal.

公开(公告)号：US20200098599A1

公开(公告)日：2020-03-26

申请号：US16397552

申请日：2019-04-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： TAEYEONG KIM ,  MINSOO HAN ,  JUN HYUNG KIM ,  HOONJOO NA ,  KWANGJIN MOON

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A substrate bonding apparatus includes a lower chuck that receives a lower substrate and an upper chuck disposed above the lower chuck. An upper substrate is fixed to the upper chuck. The upper chuck and the lower chuck bond the upper substrate to the lower substrate. The upper chuck has an upper convex surface toward the lower chuck. The upper convex surface includes a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction.