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1.发明申请公开(公告)号：US20170365591A1
公开(公告)日：2017-12-21
申请号：US15438184
申请日：2017-02-21
发明人： WON-GI CHANG , DONGWON LEE , MYUNG-SUNG KANG , HYEIN YOO
IPC分类号： H01L25/00 , H01L21/56 , H01L25/065 , H01L21/78 , H01L23/00
CPC分类号： H01L25/50 , H01L21/565 , H01L21/78 , H01L24/83 , H01L25/0657 , H01L2224/83201 , H01L2224/83931 , H01L2224/83947 , H01L2225/06544 , H01L2924/15311
摘要： A method for manufacturing a semiconductor device includes stacking, on a package substrate, first semiconductor chips. Each of the first semiconductor chips includes a first adhesive film. The method includes stacking, respectively on the first semiconductor chips, second semiconductor chips. Each of the second semiconductor chips includes a second adhesive film. The method includes compressing the first and second adhesive films to form an adhesive structure. The adhesive structure includes an extension disposed on sidewalls of the first and second semiconductor chips. The method includes removing the extension. The method includes forming a first molding layer substantially covering the first and second semiconductor chips. The method includes performing a cutting process on the package substrate between the first and second semiconductor chips to form a plurality of semiconductor packages each including at least one of the first semiconductor chips and at least one of the second semiconductor chips.
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公开(公告)号：US20200058615A1
公开(公告)日：2020-02-20
申请号：US16533450
申请日：2019-08-06
发明人： HWAIL JIN , YONGWON CHOI , MYUNG-SUNG KANG , YEONGSEOK KIM , WONKEUN KIM
摘要： A flip chip bonding method includes obtaining a die including a first substrate and an adhesive layer on the first substrate; bonding the die to a second substrate different from the first substrate; and curing the adhesive layer. The curing the adhesive layer includes heating the second substrate to melt the adhesive layer, and providing the adhesive layer and the second substrate with air having pressure greater than atmospheric pressure.
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