公开(公告)号：US10338134B2

公开(公告)日：2019-07-02

申请号：US15333699

申请日：2016-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min-Chul Jun ,  Yun-Bo Yang ,  Dong-Ho Lee ,  Tae-Hwan Oh ,  Dong-Han Yoon

IPC: G01R31/28 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H01L25/07 ,  G01R31/3185

Abstract: In an interface board for testing a multichip package, the multichip package includes a first type semiconductor chip and a second type semiconductor chip, the interface board includes a first surface facing the multichip package and a second surface facing a test apparatus, the first surface includes upper terminals that are electrically connected to terminals of the multichip package, the second surface includes lower terminals that are electrically connected to the test apparatus, and the upper terminals include a first upper terminal group for testing the first type semiconductor chip and a second upper terminal group for testing whether a crack defect exists in the second type semiconductor chip.