公开(公告)号：US20230027390A1

公开(公告)日：2023-01-26

申请号：US17689558

申请日：2022-03-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyongsoon Cho

IPC: H01L27/146

Abstract: An image sensor includes a first chip structure, a second chip structure disposed on the first chip structure, and in which pixels which each include a photoelectric conversion element are defined, and a light-transmissive cover bonded to an edge region of the second chip structure by an adhesive layer and having a recess portion covering a region in which the pixels are accommodated, wherein the second chip structure includes a substrate having a first surface and a second surface opposite to each other, color filters disposed on the second surface of the substrate to correspond to the pixels, a cover insulating layer covering the color filters, and accommodated in the recess portion and disposed to be horizontally spaced apart from an outer boundary of the recess portion, and microlenses disposed on the cover insulating layer to correspond to the pixels, respectively. An upper surface of the cover insulating layer is at a higher vertical level than the second surface of the substrate, and has a step difference of 3 μm to 15 μm with respect to the upper surface of the substrate.

公开(公告)号：US20220139984A1

公开(公告)日：2022-05-05

申请号：US17331092

申请日：2021-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyongsoon Cho

IPC: H01L27/146

Abstract: An image sensor package includes a package substrate; an image sensor chip disposed on the package substrate; a dam structure disposed on the image sensor chip and including a dam main body having an opening and a first light absorption layer disposed on an inner wall of the dam main body; a transparent substrate on the dam structure; and an encapsulant contacting the image sensor chip and an outer wall of the dam main body.

公开(公告)号：US20240213192A1

公开(公告)日：2024-06-27

申请号：US18358478

申请日：2023-07-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyongsoon Cho

IPC: H01L23/00 ,  H01L23/48 ,  H01L27/146

CPC classification number: H01L24/05 ,  H01L23/481 ,  H01L24/13 ,  H01L24/32 ,  H01L27/14618 ,  H01L2224/02372 ,  H01L2224/05548 ,  H01L2224/13025 ,  H01L2224/32245 ,  H01L2924/13091

Abstract: A semiconductor package includes a silicon substrate including a plurality of through openings, and a redistribution wiring layer including a first surface and a second surface opposite the first surface, the second surface facing the silicon substrate, the redistribution wiring layer including a first pad area and a second pad area. The redistribution wiring layer includes a plurality of bonding pads on the first pad area at the first surface, a plurality of test pads on the second pad area at the first surface, a plurality of landing pads on the second pad area at the second surface, the plurality of landing pads in communication with the plurality of through openings, respectively, and a plurality of redistribution wires electrically connected to the plurality of bonding pads and the plurality of landing pads.

公开(公告)号：US11574943B2

公开(公告)日：2023-02-07

申请号：US16996058

申请日：2020-08-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyongsoon Cho

IPC: H01L27/146

Abstract: A semiconductor package is provided. The package includes a semiconductor chip that includes photoelectric conversion elements provided on an active array region of the semiconductor chip; a transparent member on the semiconductor chip; and a spacer between the semiconductor chip and the transparent member, and horizontally spaced apart from the active array region. The spacer includes: a supporter that extends from a top surface of the semiconductor chip toward a bottom surface of the transparent member; a first adhesive pattern that is between the semiconductor chip and a bottom surface of the supporter; and a second adhesive pattern that is between the transparent member a top surface of the supporter. The spacer protrudes from a lateral surface of the semiconductor chip, and a lateral surface of the spacer is offset from the lateral surface of the semiconductor chip.

公开(公告)号：US12243886B2

公开(公告)日：2025-03-04

申请号：US18097786

申请日：2023-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyongsoon Cho

IPC: H01L27/146

Abstract: A semiconductor package is provided. The package includes a semiconductor chip that includes photoelectric conversion elements provided on an active array region of the semiconductor chip; a transparent member on the semiconductor chip; and a spacer between the semiconductor chip and the transparent member, and horizontally spaced apart from the active array region. The spacer includes: a supporter that extends from a top surface of the semiconductor chip toward a bottom surface of the transparent member; a first adhesive pattern that is between the semiconductor chip and a bottom surface of the supporter; and a second adhesive pattern that is between the transparent member a top surface of the supporter. The spacer protrudes from a lateral surface of the semiconductor chip, and a lateral surface of the spacer is offset from the lateral surface of the semiconductor chip.

公开(公告)号：US11894405B2

公开(公告)日：2024-02-06

申请号：US17331092

申请日：2021-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyongsoon Cho

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14685

Abstract: An image sensor package includes a package substrate; an image sensor chip disposed on the package substrate; a dam structure disposed on the image sensor chip and including a dam main body having an opening and a first light absorption layer disposed on an inner wall of the dam main body; a transparent substrate on the dam structure; and an encapsulant contacting the image sensor chip and an outer wall of the dam main body.

公开(公告)号：US20230299111A1

公开(公告)日：2023-09-21

申请号：US18106143

申请日：2023-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeokjong Lee ,  Minho Kwon ,  Kyongsoon Cho

IPC: H01L27/146 ,  H01L21/66 ,  H01L23/60 ,  H01L27/02 ,  H01L25/065

CPC classification number: H01L27/14636 ,  H01L22/14 ,  H01L23/60 ,  H01L27/02 ,  H01L25/0657

Abstract: A semiconductor device includes: a first semiconductor chip having an upper surface divided into a pixel array region and a connection region, wherein a plurality of pads are disposed in the connection region; and a second semiconductor chip disposed on the first semiconductor chip, wherein the plurality of pads include: a first bonding pad for connection with an external circuit; and a first probing pad adjacent to the first bonding pad and for an electrical die sorting (EDS) test, and wherein the second semiconductor chip includes: a first space overlapping the first bonding pad in a vertical direction and in which at least a portion of an electrostatic discharge protection circuit is formed.

公开(公告)号：US09978694B2

公开(公告)日：2018-05-22

申请号：US15495051

申请日：2017-04-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyongsoon Cho ,  Myoungkyun Kil ,  Hansung Ryu

IPC: H01L23/02 ,  H01L23/22 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48 ,  H01L25/00

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package includes a first substrate, and a first semiconductor chip positioned above the first substrate. A second semiconductor chip is positioned above a top surface of the first semiconductor chip. An adhesive layer is between the first semiconductor chip and the second semiconductor chip. A second substrate is disposed on the second semiconductor chip. The second substrate substantially covers a top surface of the second semiconductor chip. A mold layer is disposed between the first substrate and the second substrate.