-
公开(公告)号:US10096714B2
公开(公告)日:2018-10-09
申请号:US15446322
申请日:2017-03-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jae-yup Chung , Myung-yoon Um , Dong-ho Cha , Jung-gun You , Gi-gwan Park
IPC: H01L29/78 , H01L21/8238 , H01L27/092 , H01L29/06 , H01L29/08 , H01L29/16 , H01L29/161
Abstract: An integrated circuit (IC) device includes a pair of fin-shaped active areas that are adjacent to each other with a fin separation area therebetween, the pair of fin-shaped active areas extend in a line, and a fin separation insulating structure in the fin separation area, wherein the pair of fin-shaped active areas includes a first fin-shaped active area having a first corner defining part of the fin separation area, and wherein the fin separation insulating structure includes a lower insulating pattern that covers sidewalls of the pair of fin-shaped active areas, and an upper insulating pattern on the lower insulating pattern to cover at least part of the first corner, the upper insulating pattern having a top surface at a level higher than a top surface of each of the pair of fin-shaped active areas.
-
公开(公告)号:US10483399B2
公开(公告)日:2019-11-19
申请号:US16150795
申请日:2018-10-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jae-yup Chung , Myung-yoon Um , Dong-ho Cha , Jung-gun You , Gi-gwan Park
IPC: H01L29/78 , H01L27/12 , H01L29/66 , H01L21/84 , H01L21/8234 , H01L27/088 , H01L21/8238 , H01L29/08 , H01L27/092 , H01L29/06 , H01L29/16 , H01L29/161
Abstract: An integrated circuit (IC) device includes a pair of fin-shaped active areas that are adjacent to each other with a fin separation area therebetween, the pair of fin-shaped active areas extend in a line, and a fin separation insulating structure in the fin separation area, wherein the pair of fin-shaped active areas includes a first fin-shaped active area having a first corner defining part of the fin separation area, and wherein the fin separation insulating structure includes a lower insulating pattern that covers sidewalls of the pair of fin-shaped active areas, and an upper insulating pattern on the lower insulating pattern to cover at least part of the first corner, the upper insulating pattern having a top surface at a level higher than a top surface of each of the pair of fin-shaped active areas.
-