专利检索 ap:("SAMSUNG ELECTRONICS CO., LTD.") AND inv:"No Ui Kim" 第 1 页

1.

发明授权
Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment 有权

公开(公告)号：US11791173B2

公开(公告)日：2023-10-17

申请号：US16741002

申请日：2020-01-13

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Seung Hoon Choi , Ja Eung Koo , No Ui Kim , Hyun Kyo Seo , Tae Min Earmme , Bo Un Yoon , Youn Cheol Jeong

IPC分类号： H01L21/67 , H01L21/02 , B24B37/34

CPC分类号： H01L21/67051 , B24B37/34 , H01L21/02057 , H01L21/02096 , H01L21/67046

摘要： Substrate cleaning equipment includes a substrate holder which supports a substrate, a swing body, a head, a first cleaning liquid supply structure, and a second cleaning liquid supply structure. The swing body moves along a sweep line on a main surface of the substrate. The head is coupled to the swing body and includes a pad attachment surface facing the substrate holder. The first cleaning liquid supply structure is coupled to the swing body and sprays a first cleaning liquid onto the main surface of the substrate. The second cleaning liquid supply structure sprays a second cleaning liquid onto the main surface of the substrate. A buffing pad is attached to the pad attachment surface.