公开(公告)号：US20240212992A1

公开(公告)日：2024-06-27

申请号：US18453378

申请日：2023-08-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changheon Lee ,  Sangki Nam ,  Kuihyun Yoon ,  Kiho Lee ,  Sangho Lee ,  Sangheun Lee ,  Jaemin Rhee ,  Junghyun Cho ,  Seoyeon Choi

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32642 ,  H01J37/32715 ,  H01J37/3299 ,  H01L21/6833 ,  H01J2237/2007 ,  H01J2237/334

Abstract: Provided is a plasma processing apparatus including a substrate chuck in a chamber, a restriction ring surrounding an outer perimeter of the substrate chuck, a movable ring on the restriction ring, and an actuator configured to move the movable ring, wherein grooves formed in the restriction ring are opened or closed by movement of the movable ring. In addition, provided is a plasma processing method using the plasma processing apparatus.