METHOD OF MEASURING DURABILITY OF NONVOLATILE MEMORY DEVICE AND METHOD OF PERFORMING WEAR-LEVELING IN STORAGE DEVICE USING THE SAME

    公开(公告)号:US20220155971A1

    公开(公告)日:2022-05-19

    申请号:US17393643

    申请日:2021-08-04

    Abstract: A method of measuring durability of a nonvolatile memory device that includes a plurality of memory blocks, the method including: periodically receiving a read command for a first memory block among the plurality of memory blocks; periodically performing a read operation on the first memory block based on the read command; periodically outputting at least one cell count value associated with the first memory block based on a result of the read operation; and periodically storing durability information associated with the first memory block in response to a periodic reception of the durability information, the durability information being obtained by accumulating the at least one cell count value.

    STORAGE SYSTEM INCLUDING HOST AND STORAGE DEVICE AND OPERATION METHOD THEREOF

    公开(公告)号:US20230054286A1

    公开(公告)日:2023-02-23

    申请号:US17848820

    申请日:2022-06-24

    Abstract: Provided are a storage system including a host and a storage device, and an operation method of the storage system. The storage device includes a memory controller and a memory device, where an operation method of the memory controller includes receiving from the host a first mode change request for a folder, which is a unit for managing at least one file, and a logical address of the at least one file, and in response to the first mode change request, rewriting to the memory device first data corresponding to the logical address in a second operating mode, and invalidating first data which is existing data already written to correspond to the logical address and the first data in a first operating mode, wherein the first mode change request sets a data operation speed to a high-speed mode for the at least one file included in the folder.

    SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20240397707A1

    公开(公告)日:2024-11-28

    申请号:US18381785

    申请日:2023-10-19

    Abstract: A semiconductor memory device includes a substrate having a cell array area and a core area near the cell array area, the cell array area including a direct contact hole exposing an active region, a buried contact in the cell array area, the buried contact being connected to a storage element, a direct contact in the cell array area, the direct contact including an upper layer and a lower layer, the upper layer including a metal, and the lower layer being in the direct contact hole in direct contact with the active region and including a silicide of the metal, bit lines in contact with the upper layer of the direct contact, and word lines crossing the bit lines.

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