公开(公告)号：US20210057602A1

公开(公告)日：2021-02-25

申请号：US16844616

申请日：2020-04-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeonghwan JANG ,  Jae-Yoon KIM ,  Sungwon KO ,  Junghee KWAK ,  Sangseok LEE ,  Suyeol LEE ,  Seungwan CHAE ,  Pun Jae CHOI

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/24 ,  H01L33/40

Abstract: A light emitting device is provided. The light emitting device includes a first semiconductor layer; a second semiconductor layer provided on a bottom surface of the first semiconductor layer; an active layer interposed between the first semiconductor layer and the second semiconductor layer; a dielectric layer provided on a bottom surface of the second semiconductor layer; a plurality of first n-contacts provided on a first etched surface of the first semiconductor layer; and a plurality of first p-contacts and a plurality of second p-contacts provided on the bottom surface of the second semiconductor layer. One first n-contact is disposed along a first edge region of the first semiconductor layer, one first p-contact is closer to the one first n-contact than one second p-contact, and an area of the one first p-contact is greater than an area of each of the second p-contacts.