公开(公告)号：US11133443B2

公开(公告)日：2021-09-28

申请号：US16507183

申请日：2019-07-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chi-Goo Kang ,  Young-Kyung Kim ,  Young-Ho Park ,  Jong-Won Park ,  Seog-Ho Lim

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/48 ,  H01L33/64 ,  H01L33/62

Abstract: A light emitting device package includes a mounting substrate including first and second lower electrode portions separated by a first groove, first and second upper electrode portions separated by a second groove connected to the first groove and disposed on the first and second lower electrode portions respectively, and an insulation support member filling the first groove, a light emitting device mounted on the first and second upper electrode portions of the mounting substrate, a double phosphor film covering an upper surface of the light emitting device, including a phosphor layer and a barrier layer sequentially stacked on each other, and having a thickness of 200 μm or less, and a sealing member on the mounting substrate covering the light emitting device and the double phosphor film.