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公开(公告)号:US20240021452A1
公开(公告)日:2024-01-18
申请号:US18117259
申请日:2023-03-03
发明人: Beomsoo Hwang , Kongwoo Lee , Myungki Song , Kyusang Lee , Seojoo Choi , Jinhyuk Choi
IPC分类号: H01L21/67 , H01L21/687 , B65G47/90
CPC分类号: H01L21/67259 , H01L21/67201 , H01L21/68707 , B65G47/905 , B65G47/907
摘要: A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.