公开(公告)号：US11515265B2

公开(公告)日：2022-11-29

申请号：US16934889

申请日：2020-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seon Hee Moon ,  Myung Sam Kang ,  Jin Gu Kim

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/538 ,  H01L23/367 ,  H01L23/552 ,  H01L21/56 ,  H01L23/31

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including a dummy metal layer; a first semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon and a first inactive surface opposing the first active surface; a first encapsulant covering at least portions of the core member and the first semiconductor chip and filling at least portions of the first through-hole; and a first connection member disposed on the core member and the first active surface of the first semiconductor chip and including a first redistribution layer electrically connected to the first connection pads, wherein the dummy metal layer is electrically insulated from signal patterns of the first redistribution layer.

公开(公告)号：US20200350262A1

公开(公告)日：2020-11-05

申请号：US16934889

申请日：2020-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seon Hee Moon ,  Myung Sam Kang ,  Jin Gu Kim

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/367 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including a dummy metal layer; a first semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon and a first inactive surface opposing the first active surface; a first encapsulant covering at least portions of the core member and the first semiconductor chip and filling at least portions of the first through-hole; and a first connection member disposed on the core member and the first active surface of the first semiconductor chip and including a first redistribution layer electrically connected to the first connection pads, wherein the dummy metal layer is electrically insulated from signal patterns of the first redistribution layer.

公开(公告)号：US10727212B2

公开(公告)日：2020-07-28

申请号：US16170469

申请日：2018-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seon Hee Moon ,  Myung Sam Kang ,  Young Gwan Ko ,  Chang Bae Lee ,  Jin Su Kim

IPC: H01L23/498 ,  H01L25/16 ,  H01L23/053 ,  H01L23/31 ,  H01L21/52 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor package includes a connection structure including a first insulation layer, a second insulation layer, first and second wiring layers, and first and second connection vias. A core structure including a core member is on the first insulation layer. A first through-hole passes through the core member. Passive components are on the first insulation layer in the first through-hole and connected to the first wiring layer through the first connection via. A first encapsulant covers at least a portion of the passive components. A second through-hole passes through the core structure and the first insulation layer. A semiconductor chip is on the second insulation layer in the second through-hole and is connected to the second wiring layer through the second connection via. A second encapsulant covers at least a portion of the semiconductor chip.

公开(公告)号：US11075193B2

公开(公告)日：2021-07-27

申请号：US16418885

申请日：2019-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myung Sam Kang ,  Young Gwan Ko ,  Yong Jin Park ,  Seon Hee Moon

IPC: H01L23/552 ,  H01L25/16 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48

Abstract: A semiconductor package includes a connection structure including an insulating layer, a redistribution layer disposed on the insulating layer, and a connection via penetrating through the insulating layer and connected to the redistribution layer, a frame disposed on the connection structure and having a through-hole, a semiconductor chip disposed in the through-hole on the connection structure and having a connection pad disposed to face the connection structure, and a passive component disposed on the frame.

公开(公告)号：US10748856B2

公开(公告)日：2020-08-18

申请号：US16103199

申请日：2018-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seon Hee Moon ,  Myung Sam Kang ,  Jin Gu Kim

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/367 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including a dummy metal layer; a first semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon and a first inactive surface opposing the first active surface; a first encapsulant covering at least portions of the core member and the first semiconductor chip and filling at least portions of the first through-hole; and a first connection member disposed on the core member and the first active surface of the first semiconductor chip and including a first redistribution layer electrically connected to the first connection pads, wherein the dummy metal layer is electrically insulated from signal patterns of the first redistribution layer.