公开(公告)号：US20170256520A1

公开(公告)日：2017-09-07

申请号：US15342200

申请日：2016-11-03

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sung Hyun MOON ,  Seong Jae HONG ,  Kyu Jong CHO ,  Seung Won KANG

IPC分类号： H01L25/075 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L33/62 ,  H01L2224/16225

摘要： Provided are a package substrate and a light emitting device package. The package substrate may include a base substrate having a plurality of mounting regions and a plurality of unit light emitting regions which include at least one of the plurality of mounting regions, a plurality of first circuit patterns disposed on the base substrate and connected to a plurality of light emitting devices in the plurality of mounting regions, a plurality of second circuit patterns connected to the plurality of unit light emitting regions, and a wire electrically connecting the plurality of second circuit patterns to the plurality of second circuit patterns, each of the plurality of second circuit patterns being connected to different unit light emitting regions, or electrically connecting the plurality of first circuit patterns to the plurality of second circuit patterns.