公开(公告)号：US20170358540A1

公开(公告)日：2017-12-14

申请号：US15622708

申请日：2017-06-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byoung-Gug MIN ,  Sungil CHO ,  Jaehoon CHOI ,  Shi-kyung KIM

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/81

Abstract: Semiconductor packages and a methods for manufacturing a semiconductor package are provided. The method includes providing a package including a substrate, a semiconductor chip provided on the substrate, and a molding layer provided on the substrate and covering the semiconductor chip, the substrate including a ground pattern exposed at one surface of the substrate; and applying a solution including metal particles and a conductive carbon material onto the molding layer to form a shielding layer covering the molding layer. The shielding layer includes the metal particles and the conductive carbon material connected to at least one of the metal particles. The shielding layer extends onto the one surface of the substrate and is electrically connected to the ground pattern.