公开(公告)号：US11061052B2

公开(公告)日：2021-07-13

申请号：US16368493

申请日：2019-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Hoon Lee ,  Byoung-Joo Kim ,  Mi-Rye Lee ,  Hwang-Jin Yeo ,  Tae-Jong Lee

IPC: G01R1/067 ,  G01R31/26 ,  G01R1/073

Abstract: A probe includes a probe body for providing an object with a test signal; a tip arranged on an end of the probe body to make contact with the object; and an alignment key protruded from a side of the probe body.

公开(公告)号：US20240006215A1

公开(公告)日：2024-01-04

申请号：US18195757

申请日：2023-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Hyuk PARK ,  Youn Gon Oh ,  Hyuk Kwon ,  Young-Kyu Kim ,  Ji Hun Kim ,  Sung-Hoon Lee ,  Jeong Kwan Jung

IPC: H01L21/677

CPC classification number: H01L21/67733 ,  H01L21/67769 ,  H01L21/6773 ,  H01L21/67706 ,  H01L21/67736

Abstract: A wafer storage and transport system includes a ceiling surface which includes a first surface and a second surface, a first traveling rail installed on the second surface, a second traveling rail which is spaced apart from the first surface in a third direction, and extends in a first direction, a transport unit which is movable in the first direction along the second traveling rail and transports a FOUP, storage spaces installed on the first surface and which may store the FOUP, an interface port installed on the second surface and which temporarily stores the FOUP, and an OHT which is movable along the first traveling rail, wherein the transport unit grasps the FOUP arranged in the storage spaces and transports the FOUP to the interface port, and the OHT grasps the FOUP temporarily stored in the interface port and transports the FOUP to a semiconductor facility.

公开(公告)号：US11984338B2

公开(公告)日：2024-05-14

申请号：US17745595

申请日：2022-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn Gon Oh ,  Ji Hun Kim ,  Seung Gu Bang ,  Sung-Hoon Lee ,  Ho Chan Lee ,  Hyeong Seok Choo

IPC: H01L21/677 ,  B66C19/00

CPC classification number: H01L21/6773 ,  B66C19/00 ,  H01L21/67736

Abstract: A substrate transfer system capable of performing efficient distribution exchange between fabricating facilities is provided. The substrate transfer system includes a lower rail, an upper rail which is located above the lower rail from a ground plane, and extends to be parallel to the lower rail, a conveyor which extends to intersect the lower rail and the upper rail, below the lower rail, a first lower transport unit which transports a first carrier along the lower rail and unloads the first carrier onto the conveyor, and a first upper transport unit which transports a second carrier along the upper rail and unloads the second carrier onto the conveyor, wherein the conveyor includes a linear module which moves the first carrier and the second carrier in a linear direction, and a turning module which turns the first carrier and the second carrier.