专利检索 ap:("SAMSUNG ELECTRONICS CO., LTD.") AND inv:"Sunga YANG" 第 1 页

1.

发明公开
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL HAVING PHASE CHANGE MATERIAL 审中-公开

公开(公告)号：US20240304565A1

公开(公告)日：2024-09-12

申请号：US18435107

申请日：2024-02-07

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sungbok LEE , Dongkee JUNG , Kyuhwan LEE , Haejin LEE , Jieun HWANG , Myungjun KIM , Min PARK , Sunga YANG

IPC分类号： H01L23/552 , H01L23/367 , H05K7/20 , H05K9/00

CPC分类号： H01L23/552 , H01L23/3675 , H05K7/20445 , H05K9/0032

摘要： According to an embodiment, an electronic device includes: an electronic component, a shield can including an opening aligned with the electronic component, a shielding sheet disposed on the shield-can, wherein heat generated from the electronic component is configured to be transferred to the shielding sheet, and a thermal interface material (TIM) configured to transfer heat generated from the electronic component to the shielding sheet and extending from the electronic component to the shielding sheet through at least a portion of the opening. The thermal interface material includes a phase change material (PCM), and is included at least partially in the shielding sheet.