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公开(公告)号：US20230156989A1
公开(公告)日：2023-05-18
申请号：US17986242
申请日：2022-11-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Haejin LEE , Min PARK , Kyuhwan LEE
CPC classification number: H05K9/0088 , H05K9/0024 , H05K1/0203 , H05K9/009 , H04M1/0277
Abstract: The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.
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公开(公告)号：US20250021136A1
公开(公告)日：2025-01-16
申请号：US18902001
申请日：2024-09-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyuhwan LEE , Haejin LEE
Abstract: An electronic apparatus includes: a first housing; a second housing coupled to the first housing such as to be slidable in a first direction away from the first housing and in a second direction opposite to the first direction; a roller including a rotation shaft oriented perpendicular to the first direction and the second direction, the roller being in at least one from among the second housing and the first housing; and a heat transfer sheet including a flexible and thermally conductive material, wherein one end portion of the heat transfer sheet is coupled to the roller, wherein the roller is configured to wind the heat transfer sheet in a case where the second housing slides in the second direction and unwind the heat transfer sheet in a case where the second housing slides in the first direction.
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公开(公告)号：US20210161034A1
公开(公告)日：2021-05-27
申请号：US16952595
申请日：2020-11-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chihwan JEONG , Kyungha KOO , Jihong KIM , Dongku KANG , Kuntak KIM , Yunjeong PARK , Kyuhwan LEE , Haejin LEE , Seyoung JANG , Hyuntae JANG
Abstract: The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition, a first opening formed on at least an area of the first bracket to allow air cooled by the first cooling fan and/or the second cooling fan to move to the holding portion, and a second opening formed on at least an area of the holding portion to allow the air transmitted from the first opening to move outside the wireless charging device.
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Patent Agency Ranking
公开(公告)号：US20240334588A1
公开(公告)日：2024-10-03
申请号：US18739889
申请日：2024-06-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jichul KIM , Jaeheung YE , Kyuhwan LEE , Kwangho JUNG
CPC classification number: H05K1/0203 , H05K1/145 , H05K1/181 , H05K7/20409 , H05K2201/10159 , H05K2201/10318 , H05K2201/10568
Abstract: An electronic device according to an embodiment of the disclosure may include: a first circuit board; a second circuit board with a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction and facing the first circuit board; a first electronic component disposed between the first circuit board and the second surface of the second circuit board, and disposed in a first area of the second circuit board; a second electronic component disposed in a second area of the second circuit board; a heat dissipation device comprising a thermally conductive material disposed on the first surface of the second circuit board; a first heat transfer member comprising a thermally conductive material configured to transfer heat from the first electronic component to the heat dissipation device; and a second heat transfer member comprising a thermally conductive material configured to transfer heat from the second electronic component to the first circuit board.
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公开(公告)号：US20240304565A1
公开(公告)日：2024-09-12
申请号：US18435107
申请日：2024-02-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungbok LEE , Dongkee JUNG , Kyuhwan LEE , Haejin LEE , Jieun HWANG , Myungjun KIM , Min PARK , Sunga YANG
IPC: H01L23/552 , H01L23/367 , H05K7/20 , H05K9/00
CPC classification number: H01L23/552 , H01L23/3675 , H05K7/20445 , H05K9/0032
Abstract: According to an embodiment, an electronic device includes: an electronic component, a shield can including an opening aligned with the electronic component, a shielding sheet disposed on the shield-can, wherein heat generated from the electronic component is configured to be transferred to the shielding sheet, and a thermal interface material (TIM) configured to transfer heat generated from the electronic component to the shielding sheet and extending from the electronic component to the shielding sheet through at least a portion of the opening. The thermal interface material includes a phase change material (PCM), and is included at least partially in the shielding sheet.
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6.发明公开公开(公告)号：US20230156902A1
公开(公告)日：2023-05-18
申请号：US18091368
申请日：2022-12-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyuhwan LEE , Min PARK , Haejin LEE , Jaeheung YE , Yeonkyung CHUNG
IPC: H05K1/02
CPC classification number: H05K1/0203 , H05K2201/10378
Abstract: An electronic device includes a printed circuit board (“PCB”) structure which accommodates a thermal interface material (“TIM”). The PCB structure includes a base plate, a first component on the base plate, a second component on the base plate and apart from the first component, an interposer connected to the base plate and surrounding the first component and the second component, a cover plate connected to the interposer and covering the first component and the second component, and an accommodation part which is between the base plate and a heat conduction plate and accommodates the TIM.
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公开(公告)号：US20230199097A1
公开(公告)日：2023-06-22
申请号：US18110451
申请日：2023-02-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongkee JUNG , Kyuhwan LEE , Haejin LEE , Juhee HAN
CPC classification number: H04M1/0268 , H04M1/0216 , G06F1/203
Abstract: According to various embodiments of the present disclosure, an electronic device may include a first housing, a second housing connected to the first housing via a hinge structure, an electronic component, a flexible display being configured to be foldable according to rotation, a heat dissipation sheet arranged under the flexible display, and a first adhesive layer configured to bond the flexible display and the heat dissipation sheet to each other. The heat dissipation sheet may include a first portion corresponding to the first housing, a second portion corresponding to the second housing, and a third portion interconnecting the first portion and the second portion and corresponding to the hinge structure. The third portion may include a structure that protrudes or is folded at least once with respect to the first portion and the second portion. The first adhesive layer may include a first opening corresponding to the third portion.
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公开(公告)号：US20210251110A1
公开(公告)日：2021-08-12
申请号：US17166248
申请日：2021-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin LEE , Dongku KANG , Jihong KIM , Min PARK , Yunjeong PARK , Kyuhwan LEE , Jinhwan JUNG , Ahreum HWANG , Kyungha KOO
Abstract: A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.
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