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公开(公告)号:US20240365257A1
公开(公告)日:2024-10-31
申请号:US18426005
申请日:2024-01-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sanghyeok KIM , Juyeon JIN , Taekyung KIM , Byeonghoon AHN , Wonkyoung JANG , Junho JANG , Gupil CHEONG
CPC classification number: H04W56/001 , H04W4/06
Abstract: A first electronic device is provided. The first electronic device includes a communication circuit. The first electronic device may include a processor. The processor is configured to check failing to synchronize to a broadcast isochronous stream (BIS) from a third electronic device during first periodic advertisement intervals of the third electronic device indicated based on first information for synchronizing to the BIS. The processor is configured to request, through the communication circuit, second information for synchronizing to the BIS, based on the checking. The processor is configured to synchronize to the BIS during second periodic advertisement intervals of the third electronic device indicated based on the second information received through the communication circuit from the second electronic device that is paired with the first electronic device and is synchronized to the BIS.
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公开(公告)号:US20240275387A1
公开(公告)日:2024-08-15
申请号:US18234517
申请日:2023-08-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Won Ji PARK , Sunoo KIM , Jaehee OH , Hyungwon KIM , WooSeong JANG , Taekyung KIM , Youngbin HYUN
IPC: H03K19/08
CPC classification number: H03K19/08
Abstract: A logic device includes a substrate; at least one first insulating layer on the substrate; a second insulating layer on the at least one first insulating layer; and a capacitor portion in the at least one first insulating layer and the second insulating layer, wherein the at least one first insulating layer includes a plurality of through-holes, the capacitor portion includes a capacitor structure including a lower electrode, a dielectric film, and an upper electrode, and the capacitor structure continuously extends along the inside of the plurality of through-holes and along an upper surface of the at least one first insulating layer around the plurality of through-holes.
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公开(公告)号:US20220301190A1
公开(公告)日:2022-09-22
申请号:US17668513
申请日:2022-02-10
Inventor: Youngjun KWAK , Taekyung KIM , Changick KIM , Byeongjun PARK , Changbeom PARK
Abstract: A scene flow estimation method and apparatus are provided. The scene flow estimation method includes receiving a first feature pyramid and a second feature pyramid by encoding a first frame and a second frame of an input image through the same encoder, extracting a depth feature based on the first feature pyramid, extracting a motion feature based on the first feature pyramid and the second feature pyramid, generating an overall feature based on the depth feature and the motion feature, and estimating a scene flow based on the overall feature.
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