公开(公告)号：US10741510B2

公开(公告)日：2020-08-11

申请号：US16105227

申请日：2018-08-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woon Chun Kim ,  Ji Hye Shim ,  Seung Hun Chae

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/16

Abstract: A semiconductor package includes a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, an encapsulant encapsulating at least a portion of the semiconductor chip, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer and a via electrically connected to the connection pads of the semiconductor chip, wherein at least a portion of the redistribution layer and the via is formed of a metal layer having a concave portion depressed from a lower surface thereof and filled with an insulating material.

公开(公告)号：US10790255B2

公开(公告)日：2020-09-29

申请号：US16291621

申请日：2019-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woon Chun Kim ,  Jun Heyoung Park ,  Ji Hye Shim ,  Sung Keun Park ,  Gun Lee

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/13 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: A fan-out semiconductor package includes a frame comprising a plurality of wiring layers electrically connected to one another, and having a recessed portion having a stopper layer 112aM disposed on a bottom surface of the recessed portion, and a through-hole penetrating through the stopper layer; a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and disposed in the recessed portion such that the inactive surface opposes the stopper layer; an encapsulant covering at least portions of the frame and the inactive surface of the semiconductor chip, and filling at least a portion of the recessed portion; and an interconnect structure disposed on the frame and the active surface of the semiconductor chip, and comprising a redistribution layer electrically connected to the plurality of wiring layers and the connection pad.

公开(公告)号：US20200105703A1

公开(公告)日：2020-04-02

申请号：US16291621

申请日：2019-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woon Chun Kim ,  Jun Heyoung Park ,  Ji Hye Shim ,  Sung Keun Park ,  Gun Lee

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/13 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: A fan-out semiconductor package includes a frame comprising a plurality of wiring layers electrically connected to one another, and having a recessed portion having a stopper layer 112aM disposed on a bottom surface of the recessed portion, and a through-hole penetrating through the stopper layer; a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and disposed in the recessed portion such that the inactive surface opposes the stopper layer; an encapsulant covering at least portions of the frame and the inactive surface of the semiconductor chip, and filling at least a portion of the recessed portion; and an interconnect structure disposed on the frame and the active surface of the semiconductor chip, and comprising a redistribution layer electrically connected to the plurality of wiring layers and the connection pad.