公开(公告)号：US20240030083A1

公开(公告)日：2024-01-25

申请号：US18187444

申请日：2023-03-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yikoan HONG ,  Seokho KIM ,  Kwangjin MOON

IPC: H01L23/34 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/34 ,  H01L25/0657 ,  H01L24/08 ,  H01L2224/08146 ,  H01L2224/08221 ,  H01L2924/182

Abstract: A semiconductor package includes a semiconductor substrate and a semiconductor chip in contact with the semiconductor substrate. The semiconductor chip has a first surface facing the semiconductor substrate and an opposite second surface. The semiconductor chip has a die region, an edge region extending around the die region and a plurality of air exhaust passages extending from the die region to an outer surface of the edge region in the first surface of the semiconductor chip. Each of the air exhaust passages includes an inlet having a first passage area, and an outlet having a second passage area greater than the first passage area.