公开(公告)号：US20240304501A1

公开(公告)日：2024-09-12

申请号：US18382998

申请日：2023-10-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jhong Kwon KIM ,  Yong Ju JEON ,  Ki Hun KIM ,  Da Young MYOUNG ,  Jeong-Su HA

IPC: H01L21/66 ,  G01N21/95

CPC classification number: H01L22/12 ,  G01N21/9501

Abstract: A method for fabricating a semiconductor device is provided. The method for fabricating the semiconductor device includes a first step of loading a first wafer including a plurality of semiconductor chips having the same pattern on a stage of a wafer inspection apparatus, a second step of inspecting the plurality of semiconductor chips using light having different wavelengths from each other, and a third step of unloading the first wafer from the stage of the wafer inspection apparatus, wherein inspecting of the plurality of semiconductor chips using the light includes inspecting patterns at the same first positions of the respective semiconductor chips, inspecting patterns at the same second positions of the respective semiconductor chips, inspecting patterns at the same k-th positions of the respective semiconductor chips, and determining the semiconductor chip having a pattern defect by combining pattern inspection results at each of the first to k-th positions.

公开(公告)号：US20180202942A1

公开(公告)日：2018-07-19

申请号：US15855520

申请日：2017-12-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyo Hyeong KANG ,  Kang Woong KO ,  Sung Yoon RYU ,  Gil Woo SONG ,  Jae Hyung AHN ,  Chul Hyung YOO ,  Kyoung Hwan LEE ,  Sung Ho JANG ,  Yong Ju JEON ,  Hyoung Jo JEON

IPC: G01N21/95 ,  H01L21/66 ,  H01L21/67

CPC classification number: G01N21/9501 ,  G01N21/31 ,  G01N21/95607 ,  H01L21/67288 ,  H01L22/12 ,  H01L22/20

Abstract: A method for measuring a semiconductor device is provided. A method for measuring a semiconductor device includes defining an interest area and an acceptable area in a chip area on a wafer; performing a first measurement of the chip area with a spectral imaging device to acquire spectrum data of the chip area; assuming the distribution of the spectrum data of a first pixel in the acceptable area is a normal distribution; calculating a distance from a central point on the normal distribution to second pixels in the interest area; selecting a position of a second pixel having a distance from the central point on the normal distribution greater than a predetermined range, among the second pixels, as a candidate position; and performing a second measurement of the candidate position.