公开(公告)号：US20150228612A1

公开(公告)日：2015-08-13

申请号：US14600324

申请日：2015-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongdae HA ,  Jaeryoung LEE ,  Chulmin KIM ,  Yisung HWANG ,  Teaseog UM ,  Yongjin JUNG

IPC: H01L23/00 ,  H01L21/683

CPC classification number: H01L24/75 ,  H01L21/67144 ,  H01L21/6838 ,  H01L2221/68363 ,  H01L2224/7555 ,  H01L2224/7565 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

Abstract: The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.

Abstract translation: 芯片接合装置包括转印单元，将基板装载到转印单元的装载构件，从转印单元卸载基板的卸载构件，支撑提供模具的晶片的晶片保持器和拾取模具中的一个的粘合构件 可以提供从晶片并且通过使用气体将拾取的模具压靠在基板上而将拾取的模具结合到装载在转印单元上的基板。

公开(公告)号：US20140238618A1

公开(公告)日：2014-08-28

申请号：US14193047

申请日：2014-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yisung HWANG ,  Sunghee CHO ,  Byungwook KIM ,  Chulmin KIM ,  Yongdae HA

IPC: H01L21/67

CPC classification number: H01L21/67132 ,  Y10T156/19

Abstract: A die ejector includes a supporting unit configured to support a bottom surface of a film on which a die may be attached. The supporting unit may have a hole formed at a center thereof. The die ejector may further include a ring-shaped elevating unit in the hole and configured to move along a vertical direction, a driving unit connected to the elevating unit and configured to move the elevating unit along the vertical direction, and a pressure controlling unit connected to the hole and configured to control a pressure of the hole.

Abstract translation: 模具喷射器包括支撑单元，该支撑单元构造成支撑其上可附接有模具的膜的底表面。 支撑单元可以具有形成在其中心的孔。 模具喷射器还可以包括在孔中的环形升降单元，其构造成沿垂直方向移动;驱动单元，其连接到升降单元并且构造成沿着垂直方向移动升降单元;压力控制单元连接 并且被配置成控制孔的压力。