PROBE AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    PROBE AND MANUFACTURING METHOD THEREOF 有权
    其研究和制造方法

    公开(公告)号:US20160183916A1

    公开(公告)日:2016-06-30

    申请号:US14833011

    申请日:2015-08-21

    Abstract: A probe includes: a piezoelectric layer to generate ultrasonic waves, a backing layer to absorb ultrasonic waves generated at the piezoelectric layer and proceeding toward a rear, a reflective layer occupying an area smaller than an area of the piezoelectric layer and provided in between the piezoelectric layer and the backing layer to amplify the ultrasonic waves generated at the piezoelectric layer, and a lens layer to focus the ultrasonic waves proceeding toward a front of the piezoelectric layer at a certain point.

    Abstract translation: 探针包括:产生超声波的压电层,用于吸收在压电层产生的超声波并朝向后方移动的背衬层,反射层占据比压电层的面积小的区域,并设置在压电体之间 层和背衬层,以放大在压电层处产生的超声波,以及透镜层,以在某一点将聚焦超声波朝向压电层的前部进行聚焦。

    ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    超声探头及其制造方法

    公开(公告)号:US20160151043A1

    公开(公告)日:2016-06-02

    申请号:US14956340

    申请日:2015-12-01

    Abstract: An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.

    Abstract translation: 超声波探头包括连接层,该连接层包括用于将换能器阵列和印刷电路板(PCB)连接到专用集成电路(ASIC)的导体阵列。 超声波探头包括发射和接收超声波的换能器阵列,电连接到换能器阵列的第一电子电路,电连接到第一电子电路的第二电子电路,以及设置在换能器阵列和第一电极之间的连接层 电子电路,并且包括与换能器阵列接触的第一导体阵列,使得换能器阵列电连接到第一电子电路和与第二电子电路接触的第二导体阵列,使得第二电子电路电连接到 第一电子电路。

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