公开(公告)号：US11409063B2

公开(公告)日：2022-08-09

申请号：US16967493

申请日：2019-02-05

Applicant: SAMTEC, INC.

Inventor： Marc Epitaux ,  John Coronati

IPC: G02B6/43 ,  G02B6/42 ,  G02B6/12

Abstract: Waveguides of optically transparent interposers are adiabatically coupled to respective waveguides of photonic integrated circuits that are mounted to the optically transparent interposers. In particular, photonic integrated circuits can be mounted to an interposer that has both optical connections and electrical connections. The optical connections of the interposer can be adiabatically coupled to the photonic integrated circuit. The electrical connections can be connected to the photonic integrated circuit and to a host board that also supports an ASIC.

公开(公告)号：US12278441B2

公开(公告)日：2025-04-15

申请号：US17273364

申请日：2019-09-04

Applicant: SAMTEC, INC.

Inventor： Marc Epitaux ,  Eric J. Zbinden ,  John Coronati ,  Jignesh H. Shah ,  Brandon Thomas Gore

IPC: H01R12/73 ,  G02B6/42 ,  H01L23/498 ,  H01L25/18 ,  H01R12/62 ,  H01R12/72 ,  H01R13/506 ,  H01R13/631 ,  H05K1/11 ,  H05K1/18

Abstract: This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance discontinuities and feature size. Additional concepts include low connector insertion force, no contact wiping, and a precise alignment mechanism between the connector contacts and those on the mating substrate.