公开(公告)号：US20250141161A1

公开(公告)日：2025-05-01

申请号：US19008974

申请日：2025-01-03

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck ,  Yasuo Sasaki ,  Julian Ferry ,  Brandon Thomas Gore

IPC: H01R13/6598 ,  H01R4/70 ,  H01R12/62 ,  H01R12/75 ,  H01R13/03 ,  H01R13/6461 ,  H01R13/6585 ,  H01R13/6589

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US20210320461A1

公开(公告)日：2021-10-14

申请号：US17259725

申请日：2019-07-12

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck ,  Yasuo Sasaki ,  Julian Ferry ,  Brandon Thomas Gore

IPC: H01R13/6598 ,  H01R13/6589 ,  H01R12/62 ,  H01R4/70 ,  H01R12/75 ,  H01R13/6461 ,  H01R13/03 ,  H01R13/6585

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US12199386B2

公开(公告)日：2025-01-14

申请号：US17608533

申请日：2020-05-01

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck, III ,  Brandon Thomas Gore ,  Yasuo Sasaki ,  Julian J. Ferry

IPC: H01R13/6599 ,  H01R12/75 ,  H01R13/6471 ,  H01R13/6587

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US12218463B2

公开(公告)日：2025-02-04

申请号：US17259725

申请日：2019-07-12

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck ,  Yasuo Sasaki ,  Julian Ferry ,  Brandon Thomas Gore

IPC: H01R13/6598 ,  H01R4/70 ,  H01R12/62 ,  H01R12/75 ,  H01R13/03 ,  H01R13/6461 ,  H01R13/6585 ,  H01R13/6589

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US20250132527A1

公开(公告)日：2025-04-24

申请号：US19007866

申请日：2025-01-02

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck ,  Brandon Thomas Gore ,  Yasuo Sasaki ,  Julian J. Ferry

IPC: H01R13/6599 ,  H01R12/75 ,  H01R13/6471 ,  H01R13/6587

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US12278441B2

公开(公告)日：2025-04-15

申请号：US17273364

申请日：2019-09-04

Applicant: SAMTEC, INC.

Inventor： Marc Epitaux ,  Eric J. Zbinden ,  John Coronati ,  Jignesh H. Shah ,  Brandon Thomas Gore

IPC: H01R12/73 ,  G02B6/42 ,  H01L23/498 ,  H01L25/18 ,  H01R12/62 ,  H01R12/72 ,  H01R13/506 ,  H01R13/631 ,  H05K1/11 ,  H05K1/18

Abstract: This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance discontinuities and feature size. Additional concepts include low connector insertion force, no contact wiping, and a precise alignment mechanism between the connector contacts and those on the mating substrate.