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    Optical module including silicon photonics chip and coupler chip
    3.
    发明授权
    Optical module including silicon photonics chip and coupler chip 有权

    公开(公告)号：US10466433B2

    公开(公告)日：2019-11-05

    申请号：US16016979

    申请日：2018-06-25

    Applicant: Samtec, Inc.

    Inventor： Marc Epitaux ,  Joshua R. Cornelius ,  John L. Nightingale

    IPC: G02B6/42 ,  G02B6/36 ,  G02B6/12 ,  G02B6/138 ,  G02B6/293 ,  G02B6/122 ,  G02B6/124

    Abstract: An optical module includes a Silicon Photonics chip that transports a light signal and a coupler chip that includes a waveguide and that is attached to the Silicon Photonics chip so that the light signal is transported along a light path between the Silicon Photonics chip and the coupler chip. The light path in the coupler chip includes a guided section that includes the waveguide that guides the light signal and an unguided section that does not guide the light signal in any other waveguide structure. The cross-sectional size of the beam defined by the light signal is largest at the interface between the Silicon Photonics chip and the coupler chip.

    Flex Circuit And Electrical Communication Assemblies Related To Same
    5.
    发明申请
    Flex Circuit And Electrical Communication Assemblies Related To Same 有权

    公开(公告)号：US20220140514A1

    公开(公告)日：2022-05-05

    申请号：US17517395

    申请日：2021-11-02

    Applicant: Samtec, Inc.

    Inventor： Jonathan E. Buck ,  Marc Epitaux

    IPC: H01R13/02 ,  H01R13/6461 ,  H01R13/629 ,  H01R24/38

    Abstract: Flex circuit embodiments are provided having high signal conductor density and high signal integrity. Electrical communication systems are described that are configured to be placed in electrical communication with the flex circuits. Electrical communication systems are described that include an electrical connector that is selectively intermatable with an electrical connector that is mounted to a flex circuit, and an electrical connector that is mounted to a substrate such as a printed circuit board (PCB).

    OPTICAL TRANSCEIVER
    6.
    发明申请
    OPTICAL TRANSCEIVER 审中-公开

    公开(公告)号：US20200310054A1

    公开(公告)日：2020-10-01

    申请号：US16900097

    申请日：2020-06-12

    Applicant: Samtec, Inc.

    Inventor： Marc Epitaux ,  John L. Nightingale

    IPC: G02B6/42 ,  G02B6/35

    Abstract: An optical transceiver can include a transmitter having a photonic integrated circuit, and a receiver having a current-to-voltage converter and a photodetector in electrical communication with the current-to-voltage converter and separate from the photonic integrated circuit. Each of the transmitter and the receiver can include an interconnect member that includes first and second optical paths for the propagation of optical transmit signals and optical receive signals, respectively. The interconnect members of the transmitter and receiver can further define electrical paths that are configured to connect to an underlying substrate at one end, and the transmitter and receiver, respectively. The interconnect members can be separate from each other or can define a single monolithic interconnect member.

    Optical interposer
    7.
    发明授权
    Optical interposer 有权

    公开(公告)号：US11409063B2

    公开(公告)日：2022-08-09

    申请号：US16967493

    申请日：2019-02-05

    Applicant: SAMTEC, INC.

    Inventor： Marc Epitaux ,  John Coronati

    IPC: G02B6/43 ,  G02B6/42 ,  G02B6/12

    Abstract: Waveguides of optically transparent interposers are adiabatically coupled to respective waveguides of photonic integrated circuits that are mounted to the optically transparent interposers. In particular, photonic integrated circuits can be mounted to an interposer that has both optical connections and electrical connections. The optical connections of the interposer can be adiabatically coupled to the photonic integrated circuit. The electrical connections can be connected to the photonic integrated circuit and to a host board that also supports an ASIC.

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