公开(公告)号：US20250132527A1

公开(公告)日：2025-04-24

申请号：US19007866

申请日：2025-01-02

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck ,  Brandon Thomas Gore ,  Yasuo Sasaki ,  Julian J. Ferry

IPC: H01R13/6599 ,  H01R12/75 ,  H01R13/6471 ,  H01R13/6587

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US12087989B2

公开(公告)日：2024-09-10

申请号：US17611422

申请日：2020-05-14

Applicant: SAMTEC, INC.

Inventor： Marc Epitaux ,  Shashi Chuganey ,  Kelly Garrison ,  Thomas Albert Hall, III ,  Cindy Lee Diegel ,  James Alexander Moss ,  Francisco Noyola ,  Yasuo Sasaki ,  Scott Mcmorrow

IPC: H01P5/08 ,  H01P1/04 ,  H01P3/16

CPC classification number: H01P5/087 ,  H01P1/042 ,  H01P3/16

Abstract: Radio frequency (RF) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.

公开(公告)号：US12199386B2

公开(公告)日：2025-01-14

申请号：US17608533

申请日：2020-05-01

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck, III ,  Brandon Thomas Gore ,  Yasuo Sasaki ,  Julian J. Ferry

IPC: H01R13/6599 ,  H01R12/75 ,  H01R13/6471 ,  H01R13/6587

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US20250141161A1

公开(公告)日：2025-05-01

申请号：US19008974

申请日：2025-01-03

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck ,  Yasuo Sasaki ,  Julian Ferry ,  Brandon Thomas Gore

IPC: H01R13/6598 ,  H01R4/70 ,  H01R12/62 ,  H01R12/75 ,  H01R13/03 ,  H01R13/6461 ,  H01R13/6585 ,  H01R13/6589

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US20240421460A1

公开(公告)日：2024-12-19

申请号：US18816315

申请日：2024-08-27

Applicant: SAMTEC, INC.

Inventor： Marc Epitaux ,  Shashi Chuganey ,  Kelly Garrison ,  Thomas Albert Hall, III ,  Cindy Lee Diegel ,  James Alexander Moss ,  Francisco Noyola ,  Yasuo Sasaki ,  Scott McMorrow

IPC: H01P5/08 ,  H01P1/04 ,  H01P3/16

Abstract: Radio frequency (RF) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.

公开(公告)号：US20210320461A1

公开(公告)日：2021-10-14

申请号：US17259725

申请日：2019-07-12

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck ,  Yasuo Sasaki ,  Julian Ferry ,  Brandon Thomas Gore

IPC: H01R13/6598 ,  H01R13/6589 ,  H01R12/62 ,  H01R4/70 ,  H01R12/75 ,  H01R13/6461 ,  H01R13/03 ,  H01R13/6585

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US20250149205A1

公开(公告)日：2025-05-08

申请号：US19018034

申请日：2025-01-13

Applicant: SAMTEC, INC.

Inventor： Shashi Chuganey ,  Yasuo Sasaki ,  Scott McMorrow ,  Francisco Noyola ,  Cindy Lee Diegel ,  James Alexander Moss

IPC: H01B11/18 ,  H01B7/02 ,  H01B7/08 ,  H01B7/18 ,  H01B7/22 ,  H01B11/00 ,  H01B11/20 ,  H01P3/06 ,  H05K9/00

Abstract: Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.

公开(公告)号：US12283394B2

公开(公告)日：2025-04-22

申请号：US18182715

申请日：2023-03-13

Applicant: SAMTEC, INC.

Inventor： Shashi Chuganey ,  Yasuo Sasaki ,  Scott McMorrow ,  Francisco Noyola ,  Cindy Lee Diegel ,  James Alexander Moss

IPC: H01B11/18 ,  H01B7/02 ,  H01B7/08 ,  H01B7/18 ,  H01B7/22 ,  H01B11/00 ,  H01B11/20 ,  H05K9/00 ,  H01P3/06

Abstract: Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.

公开(公告)号：US12218463B2

公开(公告)日：2025-02-04

申请号：US17259725

申请日：2019-07-12

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck ,  Yasuo Sasaki ,  Julian Ferry ,  Brandon Thomas Gore

IPC: H01R13/6598 ,  H01R4/70 ,  H01R12/62 ,  H01R12/75 ,  H01R13/03 ,  H01R13/6461 ,  H01R13/6585 ,  H01R13/6589

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US20240421461A1

公开(公告)日：2024-12-19

申请号：US18816395

申请日：2024-08-27

Applicant: SAMTEC, INC.

Inventor： Marc Epitaux ,  Shashi Chuganey ,  Kelly Garrison ,  Thomas Albert Hall, III ,  Cindy Lee Diegel ,  James Alexander Moss ,  Francisco Noyola ,  Yasuo Sasaki ,  Scott McMorrow

IPC: H01P5/08 ,  H01P1/04 ,  H01P3/16

Abstract: Radio frequency (RP) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.