公开(公告)号：US20200321324A1

公开(公告)日：2020-10-08

申请号：US16372908

申请日：2019-04-02

Applicant: SANDISK TECHNOLOGIES LLC

Inventor： Michiaki Sano ,  Takashi YAMAHA ,  Koichi ITO ,  Ikue YOKOMIZO ,  Ryo HIRAMATSU ,  Kazuto WATANABE ,  Katsuya KATO ,  Hajime YAMAMOTO ,  Hiroshi SASAKI

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/522 ,  H01L23/528

Abstract: A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.