公开(公告)号：US20200251149A1

公开(公告)日：2020-08-06

申请号：US16269301

申请日：2019-02-06

Applicant: SANDISK TECHNOLOGIES LLC

Inventor： Yanli ZHANG ,  Zhixin CUI ,  Akio NISHIDA ,  Johann ALSMEIER ,  Yan LI ,  Steven SPROUSE

IPC: G11C5/06 ,  G06F11/08 ,  G11C8/14 ,  H01L25/065 ,  H01L27/105 ,  H01L23/498 ,  H01L23/538

Abstract: A bonded assembly includes a memory die bonded to a support die. The memory die contains at least one three-dimensional array of memory elements, memory-die dielectric material layers, and memory-die bonding pads. The support die contains at least one peripheral circuitry including complementary metal-oxide-semiconductor (CMOS) devices and configured to generate control signals for, and receive sense signals from, the at least one three-dimensional array of memory elements and a functional module and configured to provide a functionality that is independent of operation of the at least one three-dimensional array of memory elements. The functional module may include an error correction code (ECC) module, a memory module configured to interface with an external processor module located outside of the memory die, a microprocessor unit module, a wireless communication module, and/or a system level controller module.