NICKEL DIRECT-PLATING
    1.
    发明申请
    NICKEL DIRECT-PLATING 审中-公开
    镍直接涂层

    公开(公告)号:US20150041329A1

    公开(公告)日:2015-02-12

    申请号:US14250107

    申请日:2014-04-10

    摘要: A method of depositing nickel on a surface of an object, the method including the steps of providing a source of direct current having a positive and a negative terminal; connecting the object to the negative terminal; connecting an anode to the positive terminal; and submerging the object and anode in a solution comprising nickel. The anode is positioned at a distance equal to or less than 2 mm from the surface of the object and when the source of direct current is switched on, nickel in the solution comprising nickel is deposited on the surface of the object.

    摘要翻译: 一种在物体表面上沉积镍的方法,所述方法包括以下步骤:提供具有正端和负端的直流电源; 将物体连接到负极端子; 将阳极连接到正极端子; 并将物体和阳极浸没在包含镍的溶液中。 阳极被定位在离物体表面等于或小于2mm的距离处,并且当直流电源被接通时,包含镍的溶液中的镍沉积在物体的表面上。