公开(公告)号：US11523513B2

公开(公告)日：2022-12-06

申请号：US16599540

申请日：2019-10-11

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/40 ,  H05K3/32 ,  E21B41/00 ,  H05K3/12

Abstract: An adapter board is described having a substrate having a width, a length and a depth and at least one electrical component placed one of within the substrate and on a surface of the substrate. The adapter board may also have a first pad positioned on the substrate, the first pad connected to the at least one electrical component through a first via. The adapter board may also have a second pad positioned on the substrate, the second pad connected to the at least one electrical component through a second via, wherein at least a portion of the adapter board is configured through an additive manufacturing process and wherein the substrate is configured to be installed within a downhole tool.

公开(公告)号：US11141787B2

公开(公告)日：2021-10-12

申请号：US16156926

申请日：2018-10-10

Applicant: Schlumberger Technology Corporation

Inventor： Srinand Karuppoor ,  Manuel Marya

IPC: B22F3/12 ,  B22F3/15 ,  B29C64/118 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B29L31/00

Abstract: The present disclosure provides for a method of making a part using powder metallurgy and material extrusion. The method includes forming a mold of a first material using material extrusion. The method includes depositing a second material within the mold. The second material is deposited as a powder. The method includes compacting the second material within the mold, and heating the mold and the second material within the mold. During the heating, the mold is separated from the material by melting, evaporating, or burning of the first material, and the second material is sintered. Also provided for are parts made by the method and a system for making such parts. The system includes a material extrusion head and a powder deposition head. Each head is articulable along three axes.

公开(公告)号：US20210112663A1

公开(公告)日：2021-04-15

申请号：US16599540

申请日：2019-10-11

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/40 ,  H05K3/12 ,  H05K3/32 ,  E21B41/00

Abstract: An adapter board is described having a substrate having a width, a length and a depth and at least one electrical component placed one of within the substrate and on a surface of the substrate. The adapter board may also have a first pad positioned on the substrate, the first pad connected to the at least one electrical component through a first via. The adapter board may also have a second pad positioned on the substrate, the second pad connected to the at least one electrical component through a second via, wherein at least a portion of the adapter board is configured through an additive manufacturing process and wherein the substrate is configured to be installed within a downhole tool.

公开(公告)号：US20240080989A1

公开(公告)日：2024-03-07

申请号：US18502215

申请日：2023-11-06

Applicant: Schlumberger Technology Corporation

Inventor： Manuel Marya ,  Alireza Zolfaghari ,  Srinand Karuppoor

IPC: H05K3/00 ,  B33Y80/00 ,  C23C18/02

CPC classification number: H05K3/0041 ,  B33Y80/00 ,  C23C18/02 ,  H05K3/0032

Abstract: Thermally induced graphene sensing circuitry and methods for producing circuits from such thermally induced circuits are disclosed along with applications to hydrocarbon exploration and production, and related subterranean activities. The thermally induced graphene circuitry advantageously brings electrically interconnections otherwise absent on oilfield service tools, enabling components and tools to become smart.

公开(公告)号：US11913301B2

公开(公告)日：2024-02-27

申请号：US17658481

申请日：2022-04-08

Applicant: Schlumberger Technology Corporation

Inventor： Srinand Karuppoor ,  Abbigail Ullrich

IPC: F16J15/52 ,  F16J3/04 ,  E21B33/10 ,  E21B17/02

CPC classification number: E21B33/10 ,  E21B17/02 ,  F16J3/047 ,  F16J15/52

Abstract: A bellows assembly for a downhole tool includes a first seal ring, a second seal ring, and a bellows positioned at least partially between the first and second seal rings. The first seal ring, the second seal ring, and the bellows are integral with one another such that the bellows assembly is monolithic. The bellows is configured to expand and retract. The bellows is annular and has a diameter that varies over a length of the bellows. A material composition of the bellows varies over the length of the bellows.

公开(公告)号：US20230110573A1

公开(公告)日：2023-04-13

申请号：US18065712

申请日：2022-12-14

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/16 ,  H05K1/02 ,  B22F10/00 ,  H01C1/01 ,  H01C7/00

Abstract: Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

公开(公告)号：US11533809B2

公开(公告)日：2022-12-20

申请号：US16599554

申请日：2019-10-11

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/16 ,  H05K1/02 ,  B22F10/00 ,  H01C1/01 ,  H01C7/00

Abstract: Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

公开(公告)号：US11930598B2

公开(公告)日：2024-03-12

申请号：US18065712

申请日：2022-12-14

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/16 ,  B22F10/00 ,  H01C1/01 ,  H01C7/00 ,  H05K1/02

CPC classification number: H05K1/167 ,  B22F10/00 ,  H01C1/01 ,  H01C7/006 ,  H05K1/0296

Abstract: Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

公开(公告)号：US20210112660A1

公开(公告)日：2021-04-15

申请号：US16599554

申请日：2019-10-11

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/16 ,  B22F3/105 ,  H05K1/02

Abstract: Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

公开(公告)号：US11965398B2

公开(公告)日：2024-04-23

申请号：US16454793

申请日：2019-06-27

Applicant: Schlumberger Technology Corporation

Inventor： Manuel Marya ,  Srinand Karuppoor

IPC: E21B4/02 ,  B22F5/00 ,  B22F10/25 ,  B22F10/30 ,  B33Y50/02 ,  B33Y70/00 ,  B33Y80/00 ,  E21B4/00 ,  B22F10/14

CPC classification number: E21B4/02 ,  B22F10/25 ,  B22F10/30 ,  B33Y50/02 ,  E21B4/003 ,  B22F2005/002 ,  B22F10/14 ,  B22F2301/10 ,  B22F2302/05 ,  B22F2302/20 ,  B22F2302/406 ,  B33Y70/00 ,  B33Y80/00

Abstract: Wear resistant self-lubricating additive manufacturing parts and part features are disclosed in use with oilfield service operations.