公开(公告)号：US20230101475A1

公开(公告)日：2023-03-30

申请号：US17947747

申请日：2022-09-19

申请人： SCREEN Holdings Co., Ltd.

发明人： Takashi IZUTA ,  Hiroki TAJIRI ,  Masayuki ORISAKA

IPC分类号： B05D1/18 ,  B05C3/04 ,  B05C11/10

摘要： A substrate processing method is executed by a substrate processing apparatus. The substrate processing apparatus includes a processing tank, and a bubble supply pipe disposed in the processing tank. In the substrate processing method, a substrate holding section immerses a substrate in an alkaline processing liquid stored in the processing tank. A bubble supply section supplies bubbles to the alkaline processing liquid from below the substrate with the substrate immersed in the alkaline processing liquid, the bubbles being supplied from a plurality of bubble holes provided in the bubble supply pipe.