SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20240100573A1

    公开(公告)日:2024-03-28

    申请号:US18469260

    申请日:2023-09-18

    CPC classification number: B08B3/04

    Abstract: A substrate processing apparatus includes a processing tank, a substrate holding section, a bubble supply section, and processing liquid supply sections. The substrate holding section immerses a substrate in a processing liquid stored in the processing tank. The bubble supply section supplies bubbles to the processing liquid from below the substrate. The processing tank includes a first side wall and a second side wall. The processing liquid supply sections include one or more first processing liquid supply sections and one or more second processing liquid supply sections. The one or more first processing liquid supply sections are disposed on a side of the first side wall and supply the processing liquid toward the bubbles. The one or more second processing liquid supply sections are disposed on a side of the second side wall and supply the processing liquid toward the bubbles.

    BATCH SUBSTRATE TREATMENT APPARATUS
    2.
    发明公开

    公开(公告)号:US20240014050A1

    公开(公告)日:2024-01-11

    申请号:US18319396

    申请日:2023-05-17

    CPC classification number: H01L21/67086

    Abstract: An upward laminar flow of a treatment fluid is formed inside a treatment chamber. Substrates are immersed in the treatment fluid. Eight bubble supply pipes are disposed inside the treatment chamber, and supply bubbles in the treatment fluid from below the substrates. Two innermost bubble supply pipes out of the eight bubble supply pipes are disposed inside a recess of a punching plate so that the two bubble supply pipes are lower than the other bubble supply pipes. Even when a lifter lowers the substrates to an immersion position, an extremity of a back plate is prevented from hitting the two bubble supply pipes. Furthermore, the eight bubble supply pipes including the two innermost bubble supply pipes can uniformly supply bubbles to the surface of the substrates.

Patent Agency Ranking