公开(公告)号：US09241400B2

公开(公告)日：2016-01-19

申请号：US13974569

申请日：2013-08-23

Applicant: Seagate Technology LLC

Inventor： John Wayne Shaw ,  Jacob Charles Matousek ,  Todd Michael Lammers

IPC: H05K1/02

CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K2201/0723 ,  H05K2201/09236 ,  H05K2201/09681

Abstract: A rigid multi-layer printed circuit board (PCB) has an embedded elongated conductor between opposing first and second reference planes. The first and second reference planes are formed of conductive material and are electrically isolated from the conductor by intervening insulative material. Each of the first and second reference planes have a plurality of spaced apart windows extending therethrough, the windows aligned with the elongated conductor.

Abstract translation: 刚性多层印刷电路板（PCB）在相对的第一和第二参考平面之间具有嵌入​​的细长导体。 第一和第二参考平面由导电材料形成，并通过介入的绝缘材料与导体电隔离。 第一和第二参考平面中的每一个具有从其延伸穿过的多个间隔开的窗口，窗口与细长导体对准。

公开(公告)号：US20150055307A1

公开(公告)日：2015-02-26

申请号：US13974569

申请日：2013-08-23

Applicant: SEAGATE TECHNOLOGY LLC

Inventor： John Wayne Shaw ,  Jacob Charles Matousek ,  Todd Michael Lammers

IPC: H05K1/18

CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K2201/0723 ,  H05K2201/09236 ,  H05K2201/09681

Abstract: A rigid multi-layer printed circuit board (PCB) has an embedded elongated conductor between opposing first and second reference planes. The first and second reference planes are formed of conductive material and are electrically isolated from the conductor by intervening insulative material. Each of the first and second reference planes have a plurality of spaced apart windows extending therethrough, the windows aligned with the elongated conductor.

Abstract translation: 刚性多层印刷电路板（PCB）在相对的第一和第二参考平面之间具有嵌入​​的细长导体。 第一和第二参考平面由导电材料形成，并通过介入的绝缘材料与导体电隔离。 第一和第二参考平面中的每一个具有从其延伸穿过的多个间隔开的窗口，窗口与细长导体对准。