公开(公告)号：US20150332716A1

公开(公告)日：2015-11-19

申请号：US14277192

申请日：2014-05-14

Applicant: SEAGATE TECHNOLOGY LLC

Inventor： Jason B. Gadbois ,  Bradley Ver Meer ,  Joseph Stephan ,  Scott Matzke ,  Ravishankar Ajjanagadde Shivarama ,  Christopher Unger

IPC: G11B5/48 ,  G11B5/60

CPC classification number: G11B5/4853 ,  G11B5/607 ,  G11B5/6082 ,  G11B2005/0021

Abstract: Assemblies and methods that include a flex circuit having a slider facing surface and an opposing back surface; a slider having a back surface and an opposing air bearing surface (ABS), the slider including an electrical connection region; and a through circuit electrical connection, that is in electrical connection with the electrical connection region of the slider, the back surface of the slider interfacing with the slider facing surface of the flex circuit.

Abstract translation: 包括具有滑动面对表面和相对背面的柔性电路的组件和方法; 具有后表面和相对的空气轴承表面（ABS）的滑块，所述滑块包括电连接区域; 以及与滑块的电连接区域电连接的贯穿电路电连接，滑块的后表面与柔性电路的面向滑块的表面相接。

公开(公告)号：US09171561B1

公开(公告)日：2015-10-27

申请号：US14277192

申请日：2014-05-14

Applicant: SEAGATE TECHNOLOGY LLC

Inventor： Jason B. Gadbois ,  Bradley Ver Meer ,  Joseph Stephan ,  Scott Matzke ,  Ravishankar Ajjanagadde Shivarama ,  Christopher Unger

IPC: G11B5/48 ,  G11B5/60 ,  G11B5/00

CPC classification number: G11B5/4853 ,  G11B5/607 ,  G11B5/6082 ,  G11B2005/0021

Abstract: Assemblies and methods that include a flex circuit having a slider facing surface and an opposing back surface; a slider having a back surface and an opposing air bearing surface (ABS), the slider including an electrical connection region; and a through circuit electrical connection, that is in electrical connection with the electrical connection region of the slider, the back surface of the slider interfacing with the slider facing surface of the flex circuit.

Abstract translation: 包括具有滑动面对表面和相对背面的柔性电路的组件和方法; 具有后表面和相对的空气轴承表面（ABS）的滑块，所述滑块包括电连接区域; 以及与滑块的电连接区域电连接的贯穿电路电连接，滑块的后表面与柔性电路的面向滑块的表面相接。

公开(公告)号：US08947830B1

公开(公告)日：2015-02-03

申请号：US14300442

申请日：2014-06-10

Applicant: Seagate Technology LLC

Inventor： Aaron Michael Collins ,  Scott Matzke ,  Christopher Unger ,  Paul Davidson ,  Daniel Richard Buettner

IPC: G11B5/48

CPC classification number: G11B5/4853

Abstract: A method for forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, which includes the steps of forming a solder bump on a first surface of the slider pad, reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad, and applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a downward pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.

Abstract translation: 一种用于在滑块和悬挂垫之间形成电相互连接的方法，该方法与滑块相邻且相对于滑块形成一定角度，该方法包括以下步骤：在滑块的第一表面上形成焊料凸点，重新形成 焊料凸块进入具有从滑块垫延伸并接触悬挂垫的椭圆形状的突起，并将激光施加到椭圆形突起以回流焊料凸块，同时向焊料凸块施加向下的压力以形成焊料 滑块和悬挂垫之间的圆角。