公开(公告)号：US20210347923A1

公开(公告)日：2021-11-11

申请号：US17274537

申请日：2019-08-28

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Kohei TANAKA ,  Kengo NISHIUMI ,  Ryosuke HARADA

IPC: C08F220/18 ,  C08F220/14 ,  C08J3/12

Abstract: The present invention provides vinyl-based resin particles capable of easily smoothing the surface of a thermosetting resin film when the particles are used as a pore-forming material for a thermosetting resin. Specifically, the present invention provides vinyl-based resin particles for use in making a thermosetting resin porous, the particles having a temperature of 230° C. or higher and lower than 300° C. at 10% mass loss when heated at a rate of 10° C./min in an air atmosphere, and the particles having a mass loss percentage of 85 to 100% after being heated at 350° C. for 5 hours in an air atmosphere.