公开(公告)号：US20250104978A1

公开(公告)日：2025-03-27

申请号：US18794502

申请日：2024-08-05

Applicant: SEMES CO., LTD.

Inventor： Dong Mok LEE ,  Chun Loon CHA ,  Jong Chan PARK ,  Chae Kyun OH ,  Hyung Joon KIM

IPC: H01J37/32

Abstract: The ring assembly for a substrate processing apparatus, in which a plasma process is performed, of the present invention comprises an inner ring, in which a first plasma region is formed, an outer ring provided outside the inner ring, in which a second plasma region with a lower plasma distribution than the first plasma region is formed, and a cover ring provided on an upper surface of the outer ring, having a thickness smaller than that of the inner ring, and made of a material that has a lower etching reaction to plasma than the outer ring.