公开(公告)号：US20250104978A1

公开(公告)日：2025-03-27

申请号：US18794502

申请日：2024-08-05

Applicant: SEMES CO., LTD.

Inventor： Dong Mok LEE ,  Chun Loon CHA ,  Jong Chan PARK ,  Chae Kyun OH ,  Hyung Joon KIM

IPC: H01J37/32

Abstract: The ring assembly for a substrate processing apparatus, in which a plasma process is performed, of the present invention comprises an inner ring, in which a first plasma region is formed, an outer ring provided outside the inner ring, in which a second plasma region with a lower plasma distribution than the first plasma region is formed, and a cover ring provided on an upper surface of the outer ring, having a thickness smaller than that of the inner ring, and made of a material that has a lower etching reaction to plasma than the outer ring.

公开(公告)号：US20240159590A1

公开(公告)日：2024-05-16

申请号：US18507065

申请日：2023-11-12

Applicant: SEMES CO., LTD.

Inventor： Jin Il SUNG ,  Dong Mok LEE ,  Sun Il KIM ,  Ki Ryong LEE

IPC: G01J5/00 ,  H01J37/32

CPC classification number: G01J5/0003 ,  H01J37/32642 ,  G01J2005/0077

Abstract: Proposed is an inspection technology for inspecting a focus ring. A device and a method for inspecting the focus ring including a heat transfer member are proposed. The inspection device may include a housing configured to provide inspection space of the focus ring, with a predetermined area of an upper wall of the housing being formed of a transparent material, a hot plate provided in the housing and configured to heat treat the focus ring while the hot plate supports the focus ring, and an inspection unit configured to inspect a connection state between the focus ring and the heat transfer member by obtaining a thermal image of the focus ring after the focus ring is completely heat treated.

公开(公告)号：US20250104983A1

公开(公告)日：2025-03-27

申请号：US18738535

申请日：2024-06-10

Applicant: SEMES CO., LTD.

Inventor： Dong Mok LEE ,  Shant ARAKELYAN

IPC: H01J37/32

Abstract: A ring assembly test apparatus for a substrate processing apparatus of the present invention comprises an electrode body including a bottom electrode disposed below a test object including a ring assembly and a top electrode disposed above the test object, and a power application module for applying power to the electrode body, wherein power is applied to the electrode body to test an occurrence of arcing of the ring assembly outside the substrate processing apparatus that processes a substrate.

公开(公告)号：US20230317427A1

公开(公告)日：2023-10-05

申请号：US18097728

申请日：2023-01-17

Applicant: SEMES CO., LTD.

Inventor： Duk Hyun SON ,  Dong Mok LEE ,  Hyung Joon KIM

IPC: H01J37/32 ,  H01F7/20 ,  H01F7/02 ,  H01L21/683

CPC classification number: H01J37/32669 ,  H01F7/02 ,  H01F7/20 ,  H01J37/3211 ,  H01L21/6831 ,  H01F27/28 ,  H01J37/32155 ,  H01J2237/2007 ,  H01J2237/24564 ,  H01J2237/334

Abstract: A plasma processing apparatus using a magnetic field includes a reaction chamber, a plasma generating device connected to the reaction chamber to generate plasma in the reaction chamber, a substrate support disposed in a lower portion in the reaction chamber to support a wafer to be etched by the plasma, and a magnetic module including a permanent magnet and an electromagnet disposed vertically above the reaction chamber and a DC power supply unit connected to the electromagnet to input power to the electromagnet.

公开(公告)号：US20220139680A1

公开(公告)日：2022-05-05

申请号：US17408383

申请日：2021-08-21

Applicant: SEMES CO., LTD.

Inventor： Dong Mok LEE ,  Jin Il SUNG

IPC: H01J37/32 ,  H01L21/683

Abstract: A substrate processing apparatus and a method of fabricating the same are proposed. A bonding layer, by which a chuck body and a base plate of an electrostatic chuck device are bonded, is completely covered using a double-sealing structure in which a covering member for preventing a processing gas from infiltrating into the bonding layer and a sealing member for preventing the bonding layer from being damaged are bonded to each other. The durability and the efficiency of the operation of the electrostatic chuck device are improved.